Succinic Acid Diethyl Ester

Succinic Acid Diethyl Ester

SCHEMBL4324913

CCOC(=O)CCC(=O)OCC.[NaH]

nearest known ligand 0.63

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Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GAA P10253 2/20 0.63
MGAM O43451 1/20 0.63
SI P14410 1/20 0.63
MGAM2 Q2M2H8 1/20 0.63
CYP1A2 P05177 1/20 0.61
ALDH1A1 P00352 4/20 0.57
TRPA1 O75762 1/20 0.57
LMNA P02545 2/20 0.50
TSHR P16473 2/20 0.50
POLB P06746 2/20 0.50
HSD17B10 Q99714 1/20 0.50
CYP4F2 P78329 2/20 0.48
CYP4A11 Q02928 2/20 0.48
ALOX15 P16050 1/20 0.48
SOAT1 P35610 1/20 0.48
SMN1; SMN2 Q16637 1/20 0.47
NR1I2 O75469 1/20 0.47
PGR P06401 1/20 0.47
ADORA3 P0DMS8 1/20 0.47
PTGS2 P35354 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Succinic Acid Diethyl Ester SCHEMBL22780 0.97 GAA (0.67) GAAMGAMSIMGAM2CYP1A2
Succinic Acid Diethyl Ester SCHEMBL27768067 0.97 GAA (0.67) GAAMGAMSIMGAM2CYP1A2
Succinic Acid Diethyl Ester SCHEMBL21815758 0.94 GAA (0.63) GAAMGAMSIMGAM2CYP1A2
Succinic Acid Diethyl Ester SCHEMBL29494609 0.94 GAA (0.63) GAAMGAMSIMGAM2CYP1A2
Succinic Acid Diethyl Ester SCHEMBL28853161 0.94 GAA (0.63) GAAMGAMSIMGAM2CYP1A2
Succinic Acid Diethyl Ester SCHEMBL27525301 0.94 GAA (0.63) GAAMGAMSIMGAM2CYP1A2
Succinic Acid Diethyl Ester SCHEMBL28083672 0.91 GAA (0.60) GAAMGAMSIMGAM2CYP1A2
Succinic Acid Diethyl Ester SCHEMBL29266181 0.91 GAA (0.60) GAAMGAMSIMGAM2CYP1A2
SCHEMBL11699403 0.89 GAA (0.52) GAAMGAMSIMGAM2CYP1A2
Succinic Acid Diethyl Ester SCHEMBL28738178 0.89 GAA (0.52) GAAMGAMSIMGAM2CYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 51 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118064880-A Corrosion-resistant chemical nickel plating solution and preparation method thereof 德星化工(苏州)有限公司 2024-05-24 CN claimed
CN-117444471-A Soldering paste with high temperature resistance residual after soldering and preparation process thereof 深圳市鸿慷电子有限公司 2024-01-26 CN claimed
CN-115770975-A Preparation process of environment-friendly water-based soldering flux 东莞市千岛金属锡品有限公司 2023-03-10 CN claimed
US-5710190-A Soy protein-based thermoplastic composition for foamed articles IOWA STATE UNIVERSITY RESEARCH FOUNDATION, INC. (US) 1998-01-20 US claimed
US-12325799-B1 Compositions containing lignocellulosic biomass residues, polymer composites made therefrom, and methods of making lignocellulosic biomass residues and polymer composites containing them PLANTOON TECHNOLOGIES KFT. (HU) 2025-06-10 US disclosed
CN-119978205-A Preparation method and application of elastic latex 中国石油集团渤海钻探工程有限公司 2025-05-13 CN disclosed
US-12018156-B1 Compositions containing lignocellulosic biomass residues, polymer composites made therefrom, and methods of making lignocellulosic biomass residues and polymer composites containing them PLANTOON TECHNOLOGIES KFT. (HU) 2024-06-25 US disclosed
US-12012514-B1 Compositions containing lignocellulosic biomass residues, polymer composites made therefrom, and methods of making lignocellulosic biomass residues and polymer composites containing them PLANTOON TECHNOLOGIES KFT. (HU) 2024-06-18 US disclosed
CN-118064880-A Corrosion-resistant chemical nickel plating solution and preparation method thereof 德星化工(苏州)有限公司 2024-05-24 CN disclosed
CN-117444471-A Soldering paste with high temperature resistance residual after soldering and preparation process thereof 深圳市鸿慷电子有限公司 2024-01-26 CN disclosed
CN-115770975-A Preparation process of environment-friendly water-based soldering flux 东莞市千岛金属锡品有限公司 2023-03-10 CN disclosed
CN-108863236-B Preparation method of stirring-free ultralight ceramsite concrete cutting board and stirring-free ultralight ceramsite concrete cutting board 广州大学 2021-05-11 CN disclosed
EP-1639040-A1 BIOPOLYMER STRUCTURES AND COMPONENTS Agri-Polymerix, LLC (US) 2006-03-29 EP disclosed
US-20050101700-A1 A fermentation solid from a grain, root, or tuber extruded and compounded with a thermoplastic resin, a thermosetting resin, or adhesive polymer, and can also be foamed AGRI-POLYMERIX, LLC (US) 2005-05-12 US disclosed
WO-2004113435-A1 BIOPOLYMER STRUCTURES AND COMPONENTS AGRI-POLYMERIX, LLC (US) 2004-12-29 WO disclosed
US-6806353-B2 WATER RESISTANT, STRENGTH IOWA STATE UNIVERSITY RESEARCH FOUNDATION, INC. 2004-10-19 US disclosed
US-6632925-B1 Soybean protein and polylactic acid; nontoxic IOWA STATE UNIVERSITY RESEARCH FOUNDATION, INC. 2003-10-14 US disclosed
US-20030078323-A1 Biodegradable plant protein composites and related methods IOWA STATES UNIVERSITY RESEARCH FOUNDATION, INC. 2003-04-24 US disclosed
US-5710190-A Soy protein-based thermoplastic composition for foamed articles IOWA STATE UNIVERSITY RESEARCH FOUNDATION, INC. (US) 1998-01-20 US disclosed
US-5523293-A FROM CLEAVAGE OF DISULFIDE BONDS IN SOY PROTEIN; CONSUMABLE PRODUCTS IOWA STATE UNIVERSITY RESEARCH FOUNDATION, INC. (US) 1996-06-04 US disclosed