⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22264988 | 0.72 | — | — | |
| SCHEMBL22264953 | 0.72 | — | — | |
| SCHEMBL22265020 | 0.72 | — | — | |
| SCHEMBL22265028 | 0.72 | — | — | |
| SCHEMBL10783206 | 0.69 | — | — | |
| SCHEMBL14303791 | 0.67 | — | — | |
| SCHEMBL22296900 | 0.66 | — | — | |
| SCHEMBL8932784 | 0.64 | — | — | |
| SCHEMBL13625179 | 0.63 | — | — | |
| SCHEMBL4333158 | 0.60 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20090062430-A1 | Epoxy Resin Composition for Sealing and Electronic Component Device | HITACHI CHEMICAL CO., LTD. (JP) | 2009-03-05 | — | — | US | disclosed |
| EP-1475398-B1 | INDOLE RESINS, EPOXY RESINS AND RESIN COMPOSITIONS CONTAINING THE SAME | NIPPON STEEL CHEMICAL CO (JP) | 2008-05-14 | — | — | EP | disclosed |
| US-7259213-B2 | Indole resins epoxy resins and resin compositions containing the same | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 2007-08-21 | — | — | US | disclosed |
| US-20050131167-A1 | Indole resins epoxy resins and resin compositions containing the same | NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD. (JP) | 2005-06-16 | — | — | US | disclosed |
| EP-1475398-A1 | INDOLE RESINS, EPOXY RESINS AND RESIN COMPOSITIONS CONTAINING THE SAME | Nippon Steel Chemical Co., Ltd. (JP) | 2004-11-10 | — | — | EP | disclosed |