SCHEMBL4331654

[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[BeH2].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compound	similarity	top predicted	shared targets
SCHEMBL27943934	1.00	—	—
SCHEMBL35379	1.00	—	—
SCHEMBL16679810	1.00	—	—
SCHEMBL10877553	1.00	—	—
SCHEMBL17184009	1.00	—	—
SCHEMBL10353315	1.00	—	—
SCHEMBL1274534	1.00	—	—
SCHEMBL23346293	0.82	—	—
SCHEMBL9445819	0.82	—	—
SCHEMBL22284106	0.82	—	—

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

Patent	Title	Assignee	Published	Priority	Filing	Country	Status
US-7555834-B2	Method of manufacturing an interconnection device	INTEGRATED SYSTEM TECHNOLOGIES, LLC (US)	2009-07-07	—	—	US	disclosed
US-20070077787-A1	Interconnection device	INTEGRATED SYSTEM TECHNOLOGIES, LLC, A CONNECTICUT CORPORATION	2007-04-05	—	—	US	disclosed
US-20050118842-A1	Interconnection device	INTEGRATED SYSTEMS TECHNOLOGIES, LLC	2005-06-02	—	—	US	disclosed