Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ODC1 | P11926 | 1/20 | 0.50 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.43 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.40 |
| ▸ | DNM1 | Q05193 | 5/20 | 0.38 |
| ▸ | TSHR | P16473 | 3/20 | 0.38 |
| ▸ | CA12 | O43570 | 2/20 | 0.38 |
| ▸ | CA1 | P00915 | 2/20 | 0.38 |
| ▸ | CA2 | P00918 | 2/20 | 0.38 |
| ▸ | CA3 | P07451 | 2/20 | 0.38 |
| ▸ | CA4 | P22748 | 2/20 | 0.38 |
| ▸ | CA6 | P23280 | 2/20 | 0.38 |
| ▸ | CA5A | P35218 | 2/20 | 0.38 |
| ▸ | CA7 | P43166 | 2/20 | 0.38 |
| ▸ | CA9 | Q16790 | 2/20 | 0.38 |
| ▸ | CA14 | Q9ULX7 | 2/20 | 0.38 |
| ▸ | CA5B | Q9Y2D0 | 2/20 | 0.38 |
| ▸ | LMNA | P02545 | 1/20 | 0.38 |
| ▸ | BLM | P54132 | 1/20 | 0.38 |
| ▸ | MEN1 | O00255 | 1/20 | 0.35 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL64659 | 0.93 | — | — | |
| SCHEMBL6749221 | 0.89 | ODC1 (0.53) | ODC1CYP3A4NFKB1DNM1TSHR | |
| SCHEMBL25842 | 0.89 | ODC1 (0.53) | ODC1CYP3A4NFKB1DNM1TSHR | |
| Ethylenediamine SCHEMBL10796877 | 0.89 | ODC1 (0.53) | ODC1CYP3A4NFKB1DNM1TSHR | |
| SCHEMBL11126194 | 0.89 | ODC1 (0.53) | ODC1CYP3A4NFKB1DNM1TSHR | |
| SCHEMBL2270584 | 0.89 | ODC1 (0.53) | ODC1CYP3A4NFKB1DNM1TSHR | |
| SCHEMBL11556007 | 0.89 | ODC1 (0.53) | ODC1CYP3A4NFKB1DNM1TSHR | |
| Hydrochloric Acid SCHEMBL6242549 | 0.89 | ODC1 (0.53) | ODC1CYP3A4NFKB1DNM1TSHR | |
| SCHEMBL18756832 | 0.89 | ODC1 (0.53) | ODC1CYP3A4NFKB1DNM1TSHR | |
| SCHEMBL2315281 | 0.89 | ODC1 (0.53) | ODC1CYP3A4NFKB1DNM1TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1469037-B1 | SOLVENT-SOLUBLE BLOCK COPOLYIMIDE COMPOSITION AND PROCESS FOR PRODUCING THE SAME | PI R & D CO LTD (JP) | 2008-08-06 | — | — | EP | claimed |
| CN-1307260-C | Solvent-soluble block copolyimide composition and process for producing the same | PI R & D CO LTD (JP) | 2007-03-28 | — | — | CN | claimed |
| US-20050272907-A1 | Solvent-soluble block copolymide composition and process for producing the same | PI & R&D CO., LTD. (JP) | 2005-12-08 | — | — | US | claimed |
| CN-1639262-A | Solvent-soluble block copolyimide composition and process for producing the same | PI R & D CO LTD (JP) | 2005-07-13 | — | — | CN | claimed |
| EP-1469037-A1 | SOLVENT-SOLUBLE BLOCK COPOLYIMIDE COMPOSITION AND PROCESS FOR PRODUCING THE SAME | PI R & D Co., Ltd. (JP) | 2004-10-20 | — | — | EP | claimed |
| CN-116918007-A | insulated wire | 住友电气工业株式会社 | 2023-10-20 | — | — | CN | disclosed |
| CN-116635481-A | Insulated wire and method for manufacturing the same | 住友电气工业株式会社 | 2023-08-22 | — | — | CN | disclosed |
| WO-2022190656-A2 | INSULATED ELECTRICAL WIRE AND PRODUCTION METHOD THEREFOR | 住友電気工業株式会社 | 2022-09-15 | — | — | WO | disclosed |
| EP-3389060-A1 | INSULATED WIRE, COIL AND ELECTRICAL/ELECTRONIC DEVICE | Furukawa Electric Co., Ltd. (JP) | 2018-10-17 | — | — | EP | disclosed |
| US-20180286532-A1 | INSULATED WIRE, COIL AND ELECTRIC OR ELECTRONIC EQUIPMENT | FURUKAWA ELECTRIC CO., LTD. (JP) | 2018-10-04 | — | — | US | disclosed |
| CN-108369839-A | Insulated electric conductor, coil and electric/electronic | 古河电气工业株式会社 | 2018-08-03 | — | — | CN | disclosed |
| CN-101484532-B | Heat-resistant resin varnish, heat-resistant resin films, heat-resistant resin composites, and insulated wire | SUMITOMO ELECTRIC INDUSTRIES | 2011-06-15 | — | — | CN | disclosed |
| US-20090277666-A1 | HEAT-RESISTANT RESIN VARNISH, HEAT-RESISTANT RESIN FILMS, HEAT-RESISTANT RESIN COMPOSITES, AND INSULATED WIRE | SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) | 2009-11-12 | — | — | US | disclosed |
| CN-101484532-A | Heat-resistant resin varnish, heat-resistant resin films, heat-resistant resin composites, and insulated wire | SUMITOMO ELECTRIC INDUSTRIES (JP) | 2009-07-15 | — | — | CN | disclosed |
| EP-1469037-B1 | SOLVENT-SOLUBLE BLOCK COPOLYIMIDE COMPOSITION AND PROCESS FOR PRODUCING THE SAME | PI R & D CO LTD (JP) | 2008-08-06 | — | — | EP | disclosed |
| CN-1307260-C | Solvent-soluble block copolyimide composition and process for producing the same | PI R & D CO LTD (JP) | 2007-03-28 | — | — | CN | disclosed |
| US-20050272907-A1 | Solvent-soluble block copolymide composition and process for producing the same | PI & R&D CO., LTD. (JP) | 2005-12-08 | — | — | US | disclosed |
| CN-1639262-A | Solvent-soluble block copolyimide composition and process for producing the same | PI R & D CO LTD (JP) | 2005-07-13 | — | — | CN | disclosed |
| EP-1469037-A1 | SOLVENT-SOLUBLE BLOCK COPOLYIMIDE COMPOSITION AND PROCESS FOR PRODUCING THE SAME | PI R & D Co., Ltd. (JP) | 2004-10-20 | — | — | EP | disclosed |