SCHEMBL436728

SCHEMBL436728

CCC(C)[SiH2]C(C)CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ammonia Solution, Strong SCHEMBL21802589 0.96 TSHR (0.35)
SCHEMBL15915033 0.85
SCHEMBL28920917 0.84
SCHEMBL2271343 0.84
SCHEMBL23701299 0.82
SCHEMBL2271908 0.80 KDM4E (0.31)
SCHEMBL2271561 0.80 PLA2G1B (0.31)
SCHEMBL27493569 0.79
SCHEMBL27966860 0.79
SCHEMBL2267466 0.78 KDM4E (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 100 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117377716-A Organosilicon pressure-sensitive adhesive and method for preparing same 迈图高新材料公司 2024-01-09 CN claimed
CN-103781937-B Filmogen, the diaphragm seal using the filmogen, and application thereof 东曹株式会社 2017-05-31 CN claimed
US-20160326642-A1 FILM DEPOSITION MATERIAL, SEALING FILM USING THE SAME AND USE THEREOF TOSOH CORPORATION (JP) 2016-11-10 US claimed
EP-2823083-A1 METHODS FOR MAKING SILICON CONTAINING FILMS ON THIN FILM TRANSISTOR DEVICES Air Products and Chemicals, Inc. (US) 2015-01-14 EP claimed
US-20140219903-A1 FILM DEPOSITION MATERIAL, SEALING FILM USING THE SAME AND USE THEREOF TOSOH CORPORATION (JP) 2014-08-07 US claimed
CN-103781937-A Film-forming material, sealing film using same, and use of sealing film TOSOH CORP 2014-05-07 CN claimed
WO-2013134653-A1 METHODS FOR MAKING SILICON CONTAINING FILMS ON THIN FILM TRANSISTOR DEVICES AIR PRODUCTS AND CHEMICALS, INC. (US) 2013-09-12 WO claimed
EP-2823082-B1 BARRIER MATERIALS FOR DISPLAY DEVICES VERSUM MAT US LLC (US) 2024-05-15 EP disclosed
CN-117377716-A Organosilicon pressure-sensitive adhesive and method for preparing same 迈图高新材料公司 2024-01-09 CN disclosed
CN-113549010-B Preparation and application of compound with AMPK (AMPK) agonistic activity and prodrug thereof 中国科学院上海药物研究所 2023-10-20 CN disclosed
US-11626279-B2 Compositions and methods for making silicon containing films VERSUM MATERIALS US, LLC (US) 2023-04-11 US disclosed
CN-112457295-B Compound with Axl and c-Met kinase inhibitory activity and preparation and application thereof 中国科学院上海药物研究所 2022-07-26 CN disclosed
EP-4029862-A1 COMPOUND HAVING AXL AND C-MET KINASE INHIBITORY ACTIVITY, PREPARATION THEREOF AND APPLICATION THEREOF Shanghai Institute of Materia Medica, Chinese Academy of Sciences (CN) 2022-07-20 EP disclosed
EP-0954558-A1 FUEL COMPOSITIONS EXHIBITING IMPROVED FUEL STABILITY ORR, William C. (US) 1999-11-10 EP disclosed
EP-0630933-B1 A method of producing a semiconducting material NIPPON OIL CO LTD (JP) 1999-04-14 EP disclosed
WO-1998026028-A1 FUEL COMPOSITIONS EXHIBITING IMPROVED FUEL STABILITY ORR WILLIAM C (US) 1998-06-18 WO disclosed
US-5620531-A Photovoltaic element NIPPON OIL CO., LTD. (JP) 1997-04-15 US disclosed
EP-0717451-A2 Photovoltaic element NIPPON OIL CO., LTD. (JP) 1996-06-19 EP disclosed
EP-0630933-A2 A method of producing a semiconducting material NIPPON OIL CO. LTD. (JP) 1994-12-28 EP disclosed
US-5304622-A Process for producing polysilanes NIPPON OIL COMPANY, LTD. (JP) 1994-04-19 US disclosed