⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10616426 | 0.89 | — | — | |
| SCHEMBL4380537 | 0.89 | — | — | |
| SCHEMBL27848682 | 0.87 | — | — | |
| SCHEMBL28949371 | 0.87 | — | — | |
| SCHEMBL28091647 | 0.87 | — | — | |
| SCHEMBL5476366 | 0.87 | — | — | |
| SCHEMBL578578 | 0.87 | — | — | |
| SCHEMBL29203047 | 0.87 | — | — | |
| SCHEMBL28613323 | 0.87 | — | — | |
| SCHEMBL2131744 | 0.87 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119191219-A | Wafer-level packaging structure and wafer-level chip manufacturing method | 武汉高芯科技有限公司 | 2024-12-27 | — | — | CN | disclosed |
| CN-118156233-A | Chip heat conduction and dissipation layer and preparation method thereof | 深圳先进电子材料国际创新研究院 | 2024-06-07 | — | — | CN | disclosed |
| US-11955480-B2 | Integrated circuit comprising a three-dimensional capacitor | STMICROELECTRONICS (TOURS) SAS (FR) | 2024-04-09 | — | — | US | disclosed |
| CN-116567933-A | Preparation method of quartz solid hole thin film circuit | 广州天极电子科技股份有限公司 | 2023-08-08 | — | — | CN | disclosed |
| US-20220271030-A1 | INTEGRATED CIRCUIT COMPRISING A THREE-DIMENSIONAL CAPACITOR | STMICROELECTRONICS (TOURS) SAS (FR) | 2022-08-25 | — | — | US | disclosed |
| US-11335678-B2 | Integrated circuit comprising a three-dimensional capacitor | STMICROELECTRONICS (TOURS) SAS (FR) | 2022-05-17 | — | — | US | disclosed |
| CN-209029415-U | A kind of filter chip mould group | 苏州科阳光电科技有限公司 | 2019-06-25 | — | — | CN | disclosed |
| CN-109473539-A | A kind of filter chip mould group and preparation method thereof | 苏州科阳光电科技有限公司 | 2019-03-15 | — | — | CN | disclosed |
| EP-2053667-B1 | Package structure of light emitting diode device and fabricating method thereof | ADVANCED OPTOELECTRONIC TECH (TW) | 2016-06-22 | — | — | EP | disclosed |
| EP-2053667-A2 | Package structure of photoelectronic device and fabricating method thereof | Advanced Optoelectronic Technology Inc. (TW) | 2009-04-29 | — | — | EP | disclosed |
| US-5478526-A | For sucking sample solution in sample vessel for analysis; blood analysis | KABUSHIKI KAISHA TOSHIBA (JP) | 1995-12-26 | — | — | US | disclosed |