SCHEMBL438899

SCHEMBL438899

CC(C)(C)C(=O)OC1CCC2CC1OC2=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL686265 0.88
SCHEMBL686264 0.88
SCHEMBL12994667 0.88
SCHEMBL15461959 0.86
SCHEMBL111509 0.86 CYP3A4 (0.36)
SCHEMBL685827 0.86
SCHEMBL17754132 0.85 SMN1; SMN2 (0.30)
SCHEMBL22446097 0.85 SMN1; SMN2 (0.30)
SCHEMBL18897950 0.84
SCHEMBL18793138 0.83

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 54 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9910358-B2 Patterning process and chemically amplified negative resist composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-03-06 US disclosed
US-20170329224-A1 PROCESS FOR PRODUCING PHOTORESIST PATTERN AND PHOTORESIST COMPOSITION SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2017-11-16 US disclosed
US-9645490-B2 Salt, acid generator, photoresist composition, and method for producing photoresist pattern SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2017-05-09 US disclosed
US-9618850-B2 Pattern forming process and shrink agent SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-04-11 US disclosed
US-20160200702-A1 SALT, ACID GENERATOR, PHOTORESIST COMPOSITION, AND METHOD FOR PRODUCING PHOTORESIST PATTERN SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2016-07-14 US disclosed
US-20160170298-A1 SALT, ACID GENERATOR, PHOTORESIST COMPOSITION, AND METHOD FOR PRODUCING PHOTORESIST PATTERN SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2016-06-16 US disclosed
US-20160139508-A1 COMPOUND, RESIN, RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2016-05-19 US disclosed
US-9221928-B2 Fluorine-containing sulfonate resin, fluorine-containing N-sulfonyloxyimide resin, resist composition and pattern formation method CENTRAL GLASS COMPANY, LIMITED (JP) 2015-12-29 US disclosed
US-9221928-B2 Fluorine-containing sulfonate resin, fluorine-containing N-sulfonyloxyimide resin, resist composition and pattern formation method CENTRAL GLASS COMPANY, LIMITED (JP) 2015-12-29 US disclosed
US-9152045-B2 Fluorine-containing sulfonate, fluorine-containing sulfonate resin, resist composition and pattern formation method CENTRAL GLASS COMPANY, LIMITED (JP) 2015-10-06 US disclosed
US-7887990-B2 Fluorine-containing compound, fluorine-containing polymer, postive-type resist composition, and patterning process using same CENTRAL GLASS COMPANY, LIMITED (JP) 2011-02-15 US disclosed
WO-2010140483-A1 FLUORINE-CONTAINING COMPOUND, FLUORINE-CONTAINING POLYMER COMPOUND, RESIST COMPOSITION, TOP COAT COMPOSITION AND PATTERN FORMATION METHOD セントラル硝子株式会社 (JP) 2010-12-09 WO disclosed
WO-2010044372-A1 FLUORINE-CONTAINING SULFONATES HAVING POLYMERIZABLE ANIONS AND MANUFACTURING METHOD THEREFOR, FLUORINE-CONTAINING RESINS, RESIST COMPOSITIONS, AND PATTERN-FORMING METHOD USING SAME セントラル硝子株式会社 (JP) 2010-04-22 WO disclosed
US-7541131-B2 Resist composition, compound for use in the resist composition and pattern forming method using the resist composition FUJIFILM CORPORATION (JP) 2009-06-02 US disclosed
US-20090061353-A1 Positive-Type Resist Composition CENTRAL GLASS COMPANY, LIMITED (JP) 2009-03-05 US disclosed
US-20090011199-A1 Fluorine-Containing Compound, Fluorine-Containing Polymer, Negative-Type Resist Composition, and Patterning Process Using Same CENTRAL GLASS COMPANY, LIMITED (JP) 2009-01-08 US disclosed
US-20080311507-A1 Fluorine-Containing Compound, Fluorine-Containing Polymer, Postive-Type Resist Composition, And Patterning Process Using Same CENTRAL GLASS COMPANY, LIMITED (JP) 2008-12-18 US disclosed
US-20070172761-A1 Positive photosensitive composition and method of forming pattern using the same FUJIFILM CORPORATION (JP) 2007-07-26 US disclosed
US-20070141512-A1 Photosensitive composition, pattern-forming method using the photosensitve composition and compound in the photosensitive composition FUJIFILM CORPORATION (JP) 2007-06-21 US disclosed
EP-1764647-A2 Positive resist composition for immersion exposure and pattern-forming method using the same FUJIFILM Corporation (JP) 2007-03-21 EP disclosed