SCHEMBL438904

SCHEMBL438904

CC1(C)CCC(C(=O)O)C(C)(C)N1O

nearest known ligand 0.42

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
SLC1A2 P43004 1/20 0.42
SLC1A1 P43005 1/20 0.42
L3MBTL1 Q9Y468 2/20 0.38
GAA P10253 1/20 0.38
ALDH1A1 P00352 4/20 0.32
NPSR1 Q6W5P4 1/20 0.32
APLNR P35414 1/20 0.31
KDM4E B2RXH2 1/20 0.30
HSD17B10 Q99714 1/20 0.30
FFAR3 O14843 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL438903 0.80 SLC1A2 (0.42) SLC1A2SLC1A1L3MBTL1ALDH1A1NPSR1
SCHEMBL7568939 0.80 SLC1A2 (0.42) SLC1A2SLC1A1L3MBTL1ALDH1A1NPSR1
SCHEMBL697858 0.79 GAA (0.50) SLC1A2SLC1A1L3MBTL1GAAALDH1A1
SCHEMBL4397787 0.79 GAA (0.50) SLC1A2SLC1A1L3MBTL1GAAALDH1A1
SCHEMBL13225976 0.79 GAA (0.50) SLC1A2SLC1A1L3MBTL1GAAALDH1A1
Acetic Acid SCHEMBL28482560 0.74 GAA (0.50) L3MBTL1GAA
SCHEMBL4449961 0.70 GAA (0.60) L3MBTL1GAAALDH1A1KDM4EHSD17B10
SCHEMBL19186311 0.70 GAA (0.43) L3MBTL1GAAALDH1A1KDM4EHSD17B10
SCHEMBL3147718 0.69
SCHEMBL10597667 0.68 GAA (0.41) L3MBTL1GAAALDH1A1KDM4EHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8138268-B2 Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-03-20 US claimed
US-8309658-B2 Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-11-13 US disclosed
US-8138268-B2 Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-03-20 US disclosed
US-20120063109-A1 ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE RESONAC CORPORATION (JP) 2012-03-15 US disclosed
US-20110176288-A1 ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE HITACHI CHEMICAL COMPANY LTD. (JP) 2011-07-21 US disclosed
EP-2246400-A1 Circuit connecting material Hitachi Chemical Co., Ltd. (JP) 2010-11-03 EP disclosed
EP-1754762-A1 ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE Hitachi Chemical Co., Ltd. (JP) 2007-02-21 EP disclosed
US-6416627-B1 PENDANT NITROXIDE, HYDROXYLAMINE OR HYDROXY-AMMONIUM SALT GROUPS, WATER SOLUBLE OR WATER DISPERSIBLE; PREVENT THE LOSS OF BRIGHTNESS AND ENHANCE RESISTANCE TO YELLOWING CIBA SPECIALTY CHEMICALS CORPORATION 2002-07-09 US disclosed