⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4623622 | 0.67 | — | — | |
| SCHEMBL4623618 | 0.67 | — | — | |
| SCHEMBL8170515 | 0.62 | — | — | |
| SCHEMBL4457388 | 0.62 | — | — | |
| SCHEMBL61179 | 0.59 | — | — | |
| SCHEMBL5071884 | 0.59 | — | — | |
| SCHEMBL723707 | 0.59 | — | — | |
| SCHEMBL5777849 | 0.58 | — | — | |
| SCHEMBL11775649 | 0.58 | PPP5C (0.31) | — | |
| SCHEMBL4564219 | 0.57 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7632425-B1 | Composition and associated method | GENERAL ELECTRIC COMPANY (US) | 2009-12-15 | — | — | US | disclosed |
| US-20090302280-A1 | COMPOSITION AND ASSOCIATED METHOD | GENERAL ELECTRIC COMPANY (US) | 2009-12-10 | — | — | US | disclosed |
| WO-2008127282-A2 | COMPOSITION AND ASSOCIATED METHOD | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2008-10-23 | — | — | WO | disclosed |
| WO-2008045351-A2 | COMPOSITION AND ASSOCIATED METHOD | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2008-04-17 | — | — | WO | disclosed |
| US-20080083299-A1 | COMPOSITION AND ASSOCIATED METHOD | GENERAL ELECTRIC COMPANY (US) | 2008-04-10 | — | — | US | disclosed |
| US-20080085962-A1 | Silver nanoparticles; produced by reduction of carbamate salt; electrical and thermal conductive adhesives | GENERAL ELECTRIC COMPANY (US) | 2008-04-10 | — | — | US | disclosed |
| US-20080085410-A1 | COMPOSITION AND ASSOCIATED METHOD | GENERAL ELECTRIC COMPANY (US) | 2008-04-10 | — | — | US | disclosed |
| EP-1788016-A1 | Radiation curable silicone composition | GENERAL ELECTRIC COMPANY (US) | 2007-05-23 | — | — | EP | disclosed |
| US-6610760-B2 | Epoxy-functional silicone polymer, nonfluorescing polycyclic aromatic compound containing at least one hydroxy, alkoxy or glycidyl ether substituent bonded to an aromatic carbon atom of the compound; rapid cure speed. | GENERAL ELECTRIC COMPANY | 2003-08-26 | — | — | US | disclosed |
| US-20020032249-A1 | Radiation curable silicone composition | GENERAL ELECTRIC COMPANY | 2002-03-14 | — | — | US | disclosed |
| EP-0903385-B1 | Low coefficient of friction silicone release formulations | GEN ELECTRIC (US) | 2001-12-05 | — | — | EP | disclosed |
| EP-1099737-A1 | Radiation curable silicone composition | GENERAL ELECTRIC COMPANY (US) | 2001-05-16 | — | — | EP | disclosed |
| US-5942557-A | Low coefficient of friction silicone release formulations | GENERAL ELECTRIC COMPANY (US) | 1999-08-24 | — | — | US | disclosed |
| EP-0903385-A1 | Low coefficient of friction silicone release formulations | GENERAL ELECTRIC COMPANY (US) | 1999-03-24 | — | — | EP | disclosed |