⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2759885 | 0.82 | — | — | |
| Ammonia Solution, Strong SCHEMBL2484130 | 0.78 | — | — | |
| Ethylene SCHEMBL28446 | 0.64 | — | — | |
| Ethylene SCHEMBL675897 | 0.64 | — | — | |
| SCHEMBL30807537 | 0.64 | — | — | |
| Ethylene SCHEMBL1852094 | 0.64 | — | — | |
| Ethylene SCHEMBL5329726 | 0.64 | — | — | |
| Ethylene SCHEMBL5620013 | 0.64 | — | — | |
| Ethylene SCHEMBL4579824 | 0.64 | — | — | |
| Ethylene SCHEMBL635893 | 0.64 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11891472-B2 | Composition, production method for composition, and production method for unsaturated compound | RESONAC CORPORATION (JP) | 2024-02-06 | — | — | US | disclosed |
| EP-3842414-B1 | COMPOSITION, PRODUCTION METHOD FOR COMPOSITION, AND PRODUCTION METHOD FOR UNSATURATED COMPOUND | SHOWA DENKO KK (JP) | 2023-04-05 | — | — | EP | disclosed |
| EP-3842416-B1 | COMPOSITION, PRODUCTION METHOD FOR COMPOSITION, AND PRODUCTION METHOD FOR UNSATURATED COMPOUND | SHOWA DENKO KK (JP) | 2023-03-01 | — | — | EP | disclosed |
| US-20220119585-A1 | COMPOSITION, PRODUCTION METHOD FOR COMPOSITION, AND PRODUCTION METHOD FOR UNSATURATED COMPOUND | SHOWA DENKO K.K. (JP) | 2022-04-21 | — | — | US | disclosed |
| US-20210276943-A1 | COMPOSITION, PRODUCTION METHOD FOR COMPOSITION, AND PRODUCTION METHOD FOR UNSATURATED COMPOUND | SHOWA DENKO K.K. (JP) | 2021-09-09 | — | — | US | disclosed |
| US-20210198184-A1 | COMPOSITION, PRODUCTION METHOD FOR COMPOSITION, AND PRODUCTION METHOD FOR UNSATURATED COMPOUND | SHOWA DENKO K.K. (JP) | 2021-07-01 | — | — | US | disclosed |
| EP-3842415-A1 | COMPOSITION, PRODUCTION METHOD FOR COMPOSITION, AND PRODUCTION METHOD FOR UNSATURATED COMPOUND | Showa Denko K.K. (JP) | 2021-06-30 | — | — | EP | disclosed |
| EP-3842414-A1 | COMPOSITION, PRODUCTION METHOD FOR COMPOSITION, AND PRODUCTION METHOD FOR UNSATURATED COMPOUND | Showa Denko K.K. (JP) | 2021-06-30 | — | — | EP | disclosed |
| EP-3842416-A1 | COMPOSITION, PRODUCTION METHOD FOR COMPOSITION, AND PRODUCTION METHOD FOR UNSATURATED COMPOUND | Showa Denko K.K. (JP) | 2021-06-30 | — | — | EP | disclosed |
| EP-2481583-B1 | Resin composition for laser engraving, relief printing plate precursor for laser engraving, and relief printing plate and process for making the same | FUJIFILM CORP (JP) | 2014-05-28 | — | — | EP | disclosed |
| US-20120192737-A1 | RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, AND RELIEF PRINTING PLATE AND PROCESS FOR MAKING THE SAME | FUJIFILM CORPORATION (JP) | 2012-08-02 | — | — | US | disclosed |
| EP-2481583-A2 | Resin composition for laser engraving, relief printing plate precursor for laser engraving, and relief printing plate and process for making the same | Fujifilm Corporation (JP) | 2012-08-01 | — | — | EP | disclosed |
| US-7638259-B2 | Polyimide resin soluble in aqueous alkaline solution, composition comprising the resin and cured coating prepared from the composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-12-29 | — | — | US | disclosed |
| US-20090261084-A1 | Laser Dicing Sheet and Manufacturing Method For Chip Body | LINTEC CORPORATION (JP) | 2009-10-22 | — | — | US | disclosed |
| US-20080057446-A1 | Polyimide resin soluble in aqueous alkaline solution, composition comprising the resin and cured coating prepared from the composition | SHIN-ETSU CHEMICAL CO., LTD. | 2008-03-06 | — | — | US | disclosed |