⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9576938 | 0.87 | — | — | |
| SCHEMBL29613073 | 0.87 | — | — | |
| SCHEMBL28689950 | 0.87 | — | — | |
| SCHEMBL29500550 | 0.87 | — | — | |
| SCHEMBL28525479 | 0.87 | — | — | |
| SCHEMBL2781411 | 0.87 | — | — | |
| SCHEMBL29451967 | 0.87 | — | — | |
| SCHEMBL25440124 | 0.82 | — | — | |
| SCHEMBL12076550 | 0.82 | — | — | |
| SCHEMBL3517739 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 120 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119901676-A | Paper-based chip sensor for detecting total Cr of water body by utilizing laser-induced breakdown spectroscopy | 南开大学 | 2025-04-29 | — | — | CN | claimed |
| WO-2025023372-A1 | METHOD FOR PRODUCING PALLADIUM-GOLD-SILVER TRIMETALLIC HYBRID NANOSTRUCTURE AND HYBRID NANOSTRUCTURE PRODUCED THEREBY | 부경대학교 산학협력단 | 2025-01-30 | — | — | WO | claimed |
| CN-118315519-A | Composite bonding wire and preparation method thereof | 郑州机械研究所有限公司 | 2024-07-09 | — | — | CN | claimed |
| CN-114087873-B | Preparation method of high-performance Jin Jiyin palladium alloy bonding material | 江西蓝微电子科技有限公司 | 2024-03-19 | — | — | CN | claimed |
| CN-116712661-B | Medical urethral catheterization kit for preventing urethral edema | 昆明医科大学第二附属医院 | 2023-12-29 | — | — | CN | claimed |
| CN-117320297-A | Preparation method of ultrathin flexible film packaging substrate combining photoetching and die cutting | 浙江晶引电子科技有限公司 | 2023-12-29 | — | — | CN | claimed |
| CN-115557712-B | Gold-silver-palladium ternary nanocrystalline/polystyrene micro-nano secondary structure composite material, preparation method thereof and solar evaporator thereof | 华侨大学 | 2023-10-31 | — | — | CN | claimed |
| CN-116712661-A | Medical urethral catheterization kit for preventing urethral edema | 昆明医科大学第二附属医院 | 2023-09-08 | — | — | CN | claimed |
| CN-116165255-A | Structure, preparation method and application mode of multipurpose hydrogen sensor | 深圳市鹏翔半导体有限公司 | 2023-05-26 | — | — | CN | claimed |
| CN-115557712-A | Gold-silver-palladium ternary nanocrystal/polystyrene micro-nano secondary structure composite material, preparation method thereof and solar evaporator thereof | 华侨大学 | 2023-01-03 | — | — | CN | claimed |
| CN-114959290-A | Method for selectively leaching and recycling precious metal gold, silver and palladium in electronic waste step by step | 上海第二工业大学 | 2022-08-30 | — | — | CN | claimed |
| CN-114087873-A | Preparation method of high-performance gold-based silver-palladium alloy bonding material | 江西蓝微电子科技有限公司 | 2022-02-25 | — | — | CN | claimed |
| CN-103779309-A | Gold-plating gold and silver palladium alloy single-crystal bonding filament and manufacturing method thereof | JIANGXI MICROBLUE ELECTRONIC & TECHNOLOGY CO LTD | 2014-05-07 | — | — | CN | claimed |
| CN-103779308-A | Gold-silver-palladium alloy single-crystal bonding wire and manufacturing method thereof | JIANGXI MICROBLUE ELECTRONIC & TECHNOLOGY CO LTD | 2014-05-07 | — | — | CN | claimed |
| JP-58025446-A | — | — | None | — | — | JP | disclosed |
| JP-1083254-A | — | — | None | — | — | JP | disclosed |
| US-20260092308-A1 | ANALYTE DETECTION AND QUANTIFICATION | EARLY IS GOOD INC (US) | 2026-04-02 | — | — | US | disclosed |
| EP-0412778-A2 | Dental restorations | Evans, Philip Anthony (GB) | 1991-02-13 | — | — | EP | disclosed |
| JP-S6483254-A | METAL SURFACE TREATMENT AGENT FOR ADHESION | MITSUI PETROCHEMICAL IND | 1989-03-29 | — | — | JP | disclosed |
| JP-S5825446-A | GOLD-CONTAINING SILVER INDIUM ALLOY FOR DENTAL PURPOSE AND PRODUCTION THEREOF | OHASHI KIKINZOKU BUNSEKISHIYO:KK | 1983-02-15 | — | — | JP | disclosed |