SCHEMBL4425240

SCHEMBL4425240

CCCC(CCC)OCCOCCO

nearest known ligand 0.48

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 3/20 0.48
KMT2A Q03164 3/20 0.48
THRB P10828 1/20 0.48
HTT P42858 1/20 0.48
MAPT P10636 1/20 0.48
TSHR P16473 3/20 0.48
MAPK1 P28482 2/20 0.43
ALDH1A1 P00352 3/20 0.42
USP2 O75604 1/20 0.33
LMNA P02545 1/20 0.33
CYP3A4 P08684 1/20 0.33
CASP1 P29466 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.33
SLCO1B3 Q9NPD5 1/20 0.33
SLCO1B1 Q9Y6L6 1/20 0.33
PRKCA P17252 1/20 0.31
PRKCD Q05655 1/20 0.31
CNR1 P21554 1/20 0.30
CNR2 P34972 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3364248 0.92 TSHR (0.52) MEN1KMT2ATHRBHTTMAPT
SCHEMBL31602068 0.92 MEN1 (0.45) MEN1KMT2ATHRBHTTMAPT
SCHEMBL358536 0.92 MEN1 (0.45) MEN1KMT2ATHRBHTTMAPT
SCHEMBL1665087 0.92 MEN1 (0.45) MEN1KMT2ATHRBHTTMAPT
SCHEMBL11191176 0.92 MEN1 (0.45) MEN1KMT2ATHRBHTTMAPT
SCHEMBL29520872 0.88 TSHR (0.56) MEN1KMT2ATHRBHTTMAPT
SCHEMBL29521513 0.88 TSHR (0.56) MEN1KMT2ATHRBHTTMAPT
SCHEMBL16599711 0.86 TSHR (0.39) MEN1KMT2ATHRBHTTMAPT
SCHEMBL14099686 0.86 MEN1 (0.59) MEN1KMT2ATHRBHTTMAPT
Triethylene Glycol SCHEMBL25366174 0.85 MEN1 (0.47) MEN1KMT2ATHRBHTTMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108929808-B Cleaning agent composition for lead-free solder flux and method for cleaning lead-free solder flux 荒川化学工业株式会社 2020-11-27 CN disclosed
US-20090042762-A1 CLEANER COMPOSITION FOR REMOVAL OF LEAD-FREE SOLDERING FLUX, RINSING AGENT FOR REMOVAL OF LEAD-FREE SOLDERING FLUX, AND METHOD FOR REMOVAL OF LEAD-FREE SOLDERING FLUX ARAKAWA CHEMICAL INDUSTRIES, LTD. (JP) 2009-02-12 US disclosed