SCHEMBL4433304

SCHEMBL4433304

OCCOCCOCCCCCCOCCCCCCOCCOCCO

nearest known ligand 0.75

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 4/20 0.75
KMT2A Q03164 4/20 0.75
THRB P10828 1/20 0.75
HTT P42858 1/20 0.75
MAPT P10636 1/20 0.75
TSHR P16473 2/20 0.67
MAPK1 P28482 2/20 0.67
ALDH1A1 P00352 2/20 0.45
GAA P10253 1/20 0.41
USP2 O75604 2/20 0.37
LMNA P02545 1/20 0.37
CYP3A4 P08684 1/20 0.37
CASP1 P29466 1/20 0.37
SMN1; SMN2 Q16637 1/20 0.37
SLCO1B3 Q9NPD5 1/20 0.37
SLCO1B1 Q9Y6L6 1/20 0.37
APP P05067 1/20 0.32
CYP4F2 P78329 1/20 0.32
CYP4A11 Q02928 1/20 0.32
CES2 O00748 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12754637 1.00 MEN1 (0.75) MEN1KMT2ATHRBHTTMAPT
SCHEMBL16933921 1.00 MEN1 (0.75) MEN1KMT2ATHRBHTTMAPT
SCHEMBL16609231 1.00 MEN1 (0.75) MEN1KMT2ATHRBHTTMAPT
SCHEMBL15050117 1.00 MEN1 (0.75) MEN1KMT2ATHRBHTTMAPT
SCHEMBL5191031 1.00 MEN1 (0.75) MEN1KMT2ATHRBHTTMAPT
SCHEMBL12269389 0.97 MEN1 (0.79) MEN1KMT2ATHRBHTTMAPT
SCHEMBL14029329 0.97 MEN1 (0.79) MEN1KMT2ATHRBHTTMAPT
SCHEMBL10777374 0.97 TSHR (0.71) MEN1KMT2ATHRBHTTMAPT
SCHEMBL10029520 0.97 MEN1 (0.79) MEN1KMT2ATHRBHTTMAPT
SCHEMBL11787992 0.97 MEN1 (0.79) MEN1KMT2ATHRBHTTMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20090042762-A1 CLEANER COMPOSITION FOR REMOVAL OF LEAD-FREE SOLDERING FLUX, RINSING AGENT FOR REMOVAL OF LEAD-FREE SOLDERING FLUX, AND METHOD FOR REMOVAL OF LEAD-FREE SOLDERING FLUX ARAKAWA CHEMICAL INDUSTRIES, LTD. (JP) 2009-02-12 US disclosed