SCHEMBL4436613

SCHEMBL4436613

C=CC(=O)OCCOC(CC)COCCCCCC

nearest known ligand 0.53

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
TSHR P16473 5/20 0.53
HPGD P15428 1/20 0.53
ALDH1A1 P00352 3/20 0.49
CYP3A4 P08684 1/20 0.49
LPAR1 Q92633 4/20 0.46
LPAR3 Q9UBY5 4/20 0.46
TP53 P04637 2/20 0.45
HIF1A Q16665 2/20 0.45
HSD17B10 Q99714 1/20 0.45
TLR2 O60603 4/20 0.43
PLA2G2C Q5R387 2/20 0.43
LPAR2 Q9HBW0 1/20 0.43
THRB P10828 1/20 0.42
HCAR2 Q8TDS4 1/20 0.41
USP2 O75604 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17784564 0.84 TSHR (0.57) TSHRHPGDALDH1A1CYP3A4TP53
SCHEMBL18501381 0.84 TSHR (0.61) TSHRHPGDALDH1A1CYP3A4LPAR1
SCHEMBL14718405 0.83 TSHR (0.53) TSHRHPGDALDH1A1CYP3A4TP53
SCHEMBL27662632 0.82 TSHR (0.55) TSHRHPGDALDH1A1CYP3A4TP53
SCHEMBL30338294 0.82 TSHR (0.59) TSHRHPGDALDH1A1CYP3A4TP53
SCHEMBL11115680 0.82 LPAR1 (0.50) ALDH1A1LPAR1LPAR3TLR2PLA2G2C
SCHEMBL10001567 0.82 TSHR (0.59) TSHRHPGDALDH1A1CYP3A4TP53
SCHEMBL25363010 0.82 TSHR (0.68) TSHRHPGDALDH1A1CYP3A4TP53
SCHEMBL25363547 0.82 TSHR (0.68) TSHRHPGDALDH1A1CYP3A4TP53
SCHEMBL25358324 0.82 TSHR (0.68) TSHRHPGDALDH1A1CYP3A4TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8580374-B2 Resin molded body HAMAMATSU PHOTONICS K.K. (JP) 2013-11-12 US disclosed
US-8507079-B2 Structural color body HAMAMATSU PHOTONICS K.K. (JP) 2013-08-13 US disclosed
US-8440294-B2 Structural color body HAMAMATSU PHOTONICS K.K. (JP) 2013-05-14 US disclosed
US-8394490-B2 Structural color body HAMAMATSU PHOTONICS K.K. (JP) 2013-03-12 US disclosed
US-20130004721-A1 STRUCTURAL COLOR BODY HAMAMATSU PHOTONICS K.K. (JP) 2013-01-03 US disclosed
US-20130004731-A1 STRUCTURAL COLOR BODY HAMAMATSU PHOTONICS K.K. (JP) 2013-01-03 US disclosed
US-20130004722-A1 RESIN MOLDED BODY HAMAMATSU PHOTONICS K.K. (JP) 2013-01-03 US disclosed
US-20130004754-A1 STRUCTURAL COLOR BODY HAMAMATSU PHOTONICS K.K. (JP) 2013-01-03 US disclosed
CN-101437692-B Printing spacer material ASAHI CHEMICAL CORP (JP) 2011-02-02 CN disclosed
US-7592540-B2 di(ethylene glycol) 2-ethylhexyl ether acrylate monomer, photoinitiator (benzoylperoxide), and lithium salt (LiPF6); suppresses volatilization of redox electrolyte and provides stable photoelectrochemical properties against environmental changes; high voltage and high photoelectric conversion efficiency SAMSUNG SDI CO., LTD. (KR) 2009-09-22 US disclosed
CN-101437692-A Printing spacer material ASAHI CHEMICAL CORP (JP) 2009-05-20 CN disclosed
EP-1724871-B1 Composition for Preparing Polymer Electrolyte for use in Dye-Sensitized Solar Cell SAMSUNG SDI CO LTD (KR) 2009-03-04 EP disclosed
EP-1724871-A1 Composition for Preparing Polymer Electrolyte for use in Dye-Sensitized Solar Cell Samsung SDI Co., Ltd. (KR) 2006-11-22 EP disclosed
US-20060254640-A1 di(ethylene glycol) 2-ethylhexyl ether acrylate monomer, photoinitiator (benzoylperoxide), and lithium salt (LiPF6); suppresses volatilization of redox electrolyte and provides stable photoelectrochemical properties against environmental changes; high voltage and high photoelectric conversion efficiency SAMSUNG SDI CO., LTD. (KR) 2006-11-16 US disclosed
EP-0604949-B1 Actinic-radiation-curing hot-melt pressure-sensitive adhesive composition MITSUI TOATSU CHEMICALS (JP) 1996-10-23 EP disclosed
US-5384341-A Melt viscosity stability, coating workability MITSUI TOATSU CHEMICALS, INC. (JP) 1995-01-24 US disclosed
EP-0604949-A2 Actinic-radiation-curing hot-melt pressure-sensitive adhesive composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1994-07-06 EP disclosed