SCHEMBL4437852

SCHEMBL4437852

O=C(O)c1ccc(-c2ccc(C(=O)O)c(C(=O)O)c2)c(C(=O)O)c1

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 3/20 0.53
FOLH1 Q04609 2/20 0.53
HSD17B10 Q99714 3/20 0.50
CDC25B P30305 2/20 0.50
CDC25A P30304 1/20 0.50
POLB P06746 1/20 0.49
TDP1 Q9NUW8 1/20 0.49
L3MBTL1 Q9Y468 1/20 0.49
PTPN11 Q06124 2/20 0.47
SMN1; SMN2 Q16637 1/20 0.45
CYP2C8 P10632 2/20 0.44
TTR P02766 2/20 0.42
ALDH1A1 P00352 2/20 0.42
HPGD P15428 2/20 0.42
ATM Q13315 1/20 0.42
CYP1A2 P05177 1/20 0.42
EIF4E P06730 2/20 0.41
KMT2A Q03164 2/20 0.41
MEN1 O00255 1/20 0.41
USP2 O75604 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9727757 0.93 KDM4E (0.53) KDM4EFOLH1HSD17B10CDC25BCDC25A
SCHEMBL28222622 0.88 KDM4E (0.60) KDM4EHSD17B10CDC25BCDC25APOLB
SCHEMBL10786825 0.87 KDM4E (0.50) KDM4EFOLH1HSD17B10CDC25BCDC25A
SCHEMBL7633480 0.86 FOLH1 (0.67) KDM4EFOLH1HSD17B10PTPN11SMN1; SMN2
SCHEMBL29368512 0.86 FOLH1 (0.67) KDM4EFOLH1HSD17B10PTPN11SMN1; SMN2
SCHEMBL23861 0.84 KDM4E (0.69) KDM4EHSD17B10CDC25BCDC25APOLB
SCHEMBL29350135 0.84 KDM4E (0.69) KDM4EHSD17B10CDC25BCDC25APOLB
SCHEMBL29899307 0.84 KDM4E (0.69) KDM4EHSD17B10CDC25BCDC25APOLB
SCHEMBL30163040 0.84 KDM4E (0.69) KDM4EHSD17B10CDC25BCDC25APOLB
SCHEMBL23279 0.84 KDM4E (0.69) KDM4EHSD17B10CDC25BCDC25APOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 48 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111793237-B Production method of rigid polyimide foam material 贵州航天天马机电科技有限公司 2022-06-21 CN claimed
CN-113929955-A Hard polyimide foam and preparation method thereof 航天材料及工艺研究所 2022-01-14 CN claimed
CN-110014714-B Polyimide foam composite material and preparation method and application thereof 北京市射线应用研究中心 2021-08-24 CN claimed
CN-110028668-B Preparation method of hard polyimide foam material 航天材料及工艺研究所 2021-08-10 CN claimed
CN-111501200-B Preparation method of polysiloxane imide micro-nano porous fiber non-woven fabric 北京化工大学 2021-05-07 CN claimed
CN-111793237-A Production method of rigid polyimide foam material 贵州航天天马机电科技有限公司 2020-10-20 CN claimed
CN-111690136-A Microwave-assisted preparation method of polyimide foam material 贵州航天天马机电科技有限公司 2020-09-22 CN claimed
CN-111234300-A Porous polyimide material and preparation method thereof 北京市射线应用研究中心 2020-06-05 CN claimed
CN-111040447-A Composite polyester ammonium salt powder and preparation method thereof 航天材料及工艺研究所 2020-04-21 CN claimed
CN-110655790-A Production method of polyimide foam material 贵州航天天马机电科技有限公司 2020-01-07 CN claimed
CN-110014714-A A kind of Polyimide foam composite material and the preparation method and application thereof 北京市射线应用研究中心 2019-07-16 CN claimed
CN-103740104-A Preparation method of polyimide composite material of fastening piece SHANGHAI RES INST SYNTHETIC RESINS 2014-04-23 CN claimed
EP-1616898-A1 Polyamic acids, polyimide films and polyimide-metal laminates and methods for making same DuPont-Toray Company, Ltd. (JP) 2006-01-18 EP claimed
US-20060009615-A1 Polyamic acids, polyimide films and polymide-metal laminates and methods for making same DUPONT TORAY CO. LTD. (JP) 2006-01-12 US claimed
US-5270438-A Fluorine-containing polyimides and precursors thereof HITACHI CHEMICAL COMPANY, LTD. (JP) 1993-12-14 US claimed
CN-111560171-B Resin composition 味之素株式会社 2024-06-18 CN disclosed
CN-111548625-B Resin composition 味之素株式会社 2024-04-05 CN disclosed
US-20060009615-A1 Polyamic acids, polyimide films and polymide-metal laminates and methods for making same DUPONT TORAY CO. LTD. (JP) 2006-01-12 US disclosed
EP-1614535-A1 Multi-layer polyimide films and flexible circuit substrates therefrom DuPont-Toray Company, Ltd. (JP) 2006-01-11 EP disclosed
US-20050153230-A1 Photosensitive resins, resin compositions and products of curing thereof NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2005-07-14 US disclosed