SCHEMBL4500683

SCHEMBL4500683

Cc1ccc(/C(c2cccc(Cl)c2)=[Zr](\C2=CC=CC2)c2cc(C(C)(C)C)cc3c2Cc2ccc(C(C)(C)C)cc2-3)cc1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20721338 0.95
SCHEMBL21406932 0.94
Hydrochloric Acid SCHEMBL18280839 0.94
SCHEMBL2861722 0.91
Hydrochloric Acid SCHEMBL18280803 0.90
SCHEMBL21407012 0.89
SCHEMBL20721344 0.89 KCNK3 (0.32)
SCHEMBL3835612 0.88 POLB (0.31)
Hydrochloric Acid SCHEMBL18280796 0.88 KCNK3 (0.31)
Hydrochloric Acid SCHEMBL18280808 0.88 POLB (0.30)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4011963-B1 POLYPROPYLENE RESIN COMPOSITION AND MONOLAYER AND MULTILAYER FILM MITSUI CHEMICALS INC (JP) 2024-03-13 EP disclosed
EP-2080784-B1 PROPYLENE RESIN COMPOSITION, METHOD FOR PRODUCING PROPYLENE RESIN COMPOSITION, PROPYLENE POLYMER COMPOSITION, MOLDED BODY MADE OF THE PROPYLENE RESIN COMPOSITION, AND ELECTRIC WIRE MITSUI CHEMICALS INC (JP) 2013-03-06 EP disclosed
EP-2085420-A1 POLYPROPYLENE RESIN FILM AND USE THEREOF Mitsui Chemicals, Inc. (JP) 2009-08-05 EP disclosed