SCHEMBL450342

SCHEMBL450342

CO[Si](C)(OC)OC(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7869221 0.93
SCHEMBL8375612 0.90
SCHEMBL13196737 0.88
SCHEMBL13196741 0.85
SCHEMBL28634413 0.83
SCHEMBL93160 0.82
SCHEMBL28235481 0.81
SCHEMBL28307573 0.79
SCHEMBL28880797 0.75 TSHR (0.37)
SCHEMBL9486157 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 121 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118955977-A Micro-electric bionic dynamic driving-off antifouling surface and preparation method thereof 吉林大学 2024-11-15 CN claimed
CN-117602956-A 98 alumina photovoltaic insulating ceramic 新化县群华陶瓷科技有限公司 2024-02-27 CN claimed
CN-113816388-B Preparation method of low-dielectric hollow silicon dioxide microspheres 苏州锦艺新材料科技股份有限公司 2023-07-18 CN claimed
CN-115259753-A Preparation method of flame-retardant modified toughened silicon aerogel 长春工业大学 2022-11-01 CN claimed
WO-2021253727-A1 METHOD FOR PREPARING LOW DIELECTRIC HOLLOW SILICA MICROSPHERE 苏州锦艺新材料科技有限公司 2021-12-23 WO claimed
CN-113816388-A Preparation method of low-dielectric hollow silicon dioxide microspheres 苏州锦艺新材料科技有限公司 2021-12-21 CN claimed
CN-104588137-B A kind of micro-fluidic chip and preparation method thereof 厦门大学 2017-10-17 CN claimed
CN-104588137-A Micro-fluidic chip and preparation method thereof UNIV XIAMEN 2015-05-06 CN claimed
US-8618214-B2 Fiber-reinforced polypropylene/elastomer composite EXXONMOBIL RESEARCH AND ENGINEERING COMPANY (US) 2013-12-31 US claimed
US-20120157631-A1 Fiber-Reinforced Polypropylene/Elastomer Composite EXXONMOBIL RESEARCH AND ENGINEERING COMPANY (US) 2012-06-21 US claimed
WO-2012083014-A1 FIBER-REINFORCED POLYPROPYLENE/ELASTOMER COMPOSITE EXXONMOBIL RESEARCH AND ENGINEERING COMPANY (US) 2012-06-21 WO claimed
WO-2007101174-A2 DIGITAL MAGNETOFLUIDIC DEVICES AND METHODS ARIZONA BOARD OF REGENTS FOR AND ON BEHALF OF ARIZONA STATE UNIVERSITY (US) 2007-09-07 WO claimed
US-20070054505-A1 PECVD processes for silicon dioxide films INTEL CORPORATION 2007-03-08 US claimed
US-20030068504-A1 Electronic device comprising a layer of flame retardant pressure sensitive adhesive mounted on surface, covering with a fireproofed conformal polysiloxane coatings AVAYA INC. (FORMERLY KNOWN AS AVAYA TECHNOLOGY CORP.) 2003-04-10 US claimed
US-4912000-A Electrophotographic photoreceptor JAPAN ATOMIC ENERGY RESEARCH INSTITUTE (JP) 1990-03-27 US claimed
JP-7194286-A None JP disclosed
CN-117700851-A Solvent-free resin composition and application thereof 台燿科技股份有限公司 2024-03-15 CN disclosed
WO-1993015032-A1 PROCESS OF SPRAY DRYING SIALON___________________________________ NORTON COMPANY (US) 1993-08-05 WO disclosed
US-5096864-A Mixing with a hydrophilic silane NORTON COMPANY (US) 1992-03-17 US disclosed
US-4377706-A FOR EXAMBLE, METHYLDIMETHOXYISOPROPENOXYSILANE, BY REACTION OF A POLYALKOXYSILANE AND A KETONE GENERAL ELECTRIC COMPANY (US) 1983-03-22 US disclosed