Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GRIN2D | O15399 | 7/20 | 0.56 |
| ▸ | GRIN3B | O60391 | 7/20 | 0.56 |
| ▸ | GRIN1 | Q05586 | 7/20 | 0.56 |
| ▸ | GRIN2A | Q12879 | 7/20 | 0.56 |
| ▸ | GRIN2B | Q13224 | 7/20 | 0.56 |
| ▸ | GRIN2C | Q14957 | 7/20 | 0.56 |
| ▸ | GRIN3A | Q8TCU5 | 7/20 | 0.56 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.43 |
| ▸ | MEN1 | O00255 | 1/20 | 0.41 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.41 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.40 |
| ▸ | PKM | P14618 | 1/20 | 0.40 |
| ▸ | TSHR | P16473 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL451248 | 1.00 | GRIN2D (0.56) | GRIN2DGRIN3BGRIN1GRIN2AGRIN2B | |
| Ammonia Solution, Strong SCHEMBL5271542 | 0.97 | GRIN2D (0.54) | GRIN2DGRIN3BGRIN1GRIN2AGRIN2B | |
| Adamantane SCHEMBL11758411 | 0.97 | GRIN2D (0.54) | GRIN2DGRIN3BGRIN1GRIN2AGRIN2B | |
| Hydrochloric Acid SCHEMBL5274218 | 0.94 | GRIN2D (0.52) | GRIN2DGRIN3BGRIN1GRIN2AGRIN2B | |
| SCHEMBL22117562 | 0.87 | — | — | |
| SCHEMBL2450643 | 0.82 | GRIN2D (0.71) | GRIN2DGRIN3BGRIN1GRIN2AGRIN2B | |
| SCHEMBL1939771 | 0.80 | GRIN2D (0.41) | GRIN2DGRIN3BGRIN1GRIN2AGRIN2B | |
| SCHEMBL12758973 | 0.78 | GRIN2D (0.39) | GRIN2DGRIN3BGRIN1GRIN2AGRIN2B | |
| SCHEMBL12758992 | 0.78 | GRIN2D (0.39) | GRIN2DGRIN3BGRIN1GRIN2AGRIN2B | |
| SCHEMBL11700078 | 0.78 | GRIN2D (0.39) | GRIN2DGRIN3BGRIN1GRIN2AGRIN2B |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 96 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114763394-A | Nonionic hyperbranched hydrophobically associating polyacrylamide thickening agent and preparation method thereof | 中国石油天然气股份有限公司 | 2022-07-19 | — | — | CN | claimed |
| CN-114751829-A | Polymerizable nonionic surfactant containing adamantane structure and preparation method thereof | 中国石油天然气股份有限公司 | 2022-07-15 | — | — | CN | claimed |
| WO-2024143131-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMATION METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, AND ONIUM SALT | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| CN-113939767-B | Positive photosensitive resin composition and organic EL element partition wall | 日保丽公司 | 2024-06-25 | — | — | CN | disclosed |
| CN-117882008-A | Positive photosensitive resin composition | 日保丽公司 | 2024-04-12 | — | — | CN | disclosed |
| CN-117480451-A | Positive photosensitive resin composition and organic EL element partition wall | 日保丽公司 | 2024-01-30 | — | — | CN | disclosed |
| WO-2024017921-A1 | DEVELOPER TOLERANCE RESIST UNDERLAYER COMPOSITION AND METHOD FOR MANUFACTURING RESIST PATTERN | MERCK PATENT GMBH (DE) | 2024-01-25 | — | — | WO | disclosed |
| US-20230408922-A1 | APPLICATION LIQUID FOR OPTICAL MEMBER, POLYMER, PHOTOSENSITIVE APPLICATION LIQUID, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING PATTERNED CURED FILM, AND METHOD FOR PRODUCING POLYMER | CENTRAL GLASS COMPANY, LIMITED (JP) | 2023-12-21 | — | — | US | disclosed |
| CN-116940897-A | Photosensitive resin composition and organic EL element partition wall | 株式会社力森诺科 | 2023-10-24 | — | — | CN | disclosed |
| US-20230333468-A1 | RESIN COMPOSITION, CURED FILM, METHOD FOR MANUFACTURING CURED FILM, SUBSTRATE HAVING MULTILAYER FILM, METHOD FOR PRODUCING PATTERNED SUBSTRATE, PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERN CURED FILM, METHOD FOR PRODUCING POLYMER, AND METHOD FOR PRODUCING RESIN COMPOSITION | CENTRAL GLASS COMPANY, LIMITED (JP) | 2023-10-19 | — | — | US | disclosed |
| CN-116601244-A | Coating liquid for optical member, polymer, cured film, photosensitive coating liquid, pattern cured film, optical member, solid-state imaging element, display device, silicone compound, stabilizer used in coating liquid, method for producing cured film, method for producing pattern cured film, and method for producing polymer | 中央硝子株式会社 | 2023-08-15 | — | — | CN | disclosed |
| US-20050123854-A1 | Positive resist composition and base material carrying layer of the positive resist composition | TOKYO OHKA KOGYO CO., LTD. | 2005-06-09 | — | — | US | disclosed |
| US-20050079445-A1 | Positive resist composition and method of forming resist pattern using same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-04-14 | — | — | US | disclosed |
| US-20050053861-A1 | Onium salt compound and radiation-sensitive resin composition | JSR CORPORATION (JP) | 2005-03-10 | — | — | US | disclosed |
| US-6787284-B2 | Alkali-soluble polysilsesquioxane with e.g. units of p-hydroxybenzylsilanetriol and phenylsilanetriol, an acid generator, and an acid decomposable ester, ether or carbonate-protected phenolic compound; wavelengths equal to or shorter than that of KrF excimer laser | TOKYO OHKA KOGYO CO., LTD. (JP) | 2004-09-07 | — | — | US | disclosed |
| US-20040152860-A1 | Polysilsesquioxane copolymer with unit containing an alkali-soluble group and unit containing a non-acid decomposable alkali insoluble group, e.g. phenylsilanetriol and hydroxybenzylsilanetriol units; use with wavelengths shorter than a KrF excimer laser | TOKYO OHKA KOGYO CO., LTD. | 2004-08-05 | — | — | US | disclosed |
| US-20040019152-A1 | Alcoholic hydroxyl group-, aromatic ring- and protolytically leaving group-containing copolymer | NIPPON SHOKUBAI CO., LTD. | 2004-01-29 | — | — | US | disclosed |
| EP-1357428-A1 | Alcoholic hydroxyl group-, aromatic ring- and protolytically leaving group-containing copolymer | Nippon Shokubai Co., Ltd. (JP) | 2003-10-29 | — | — | EP | disclosed |
| US-20030170561-A1 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2003-09-11 | — | — | US | disclosed |
| US-20020025495-A1 | Positive resist composition and base material carrying layer of the positive resist composition | TOKYO OHKA KOGYO CO., LTD | 2002-02-28 | — | — | US | disclosed |