⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrochloric Acid SCHEMBL27660211 | 0.98 | — | — | |
| SCHEMBL10144705 | 0.86 | — | — | |
| SCHEMBL10076591 | 0.79 | MEN1 (0.39) | — | |
| SCHEMBL515382 | 0.73 | — | — | |
| SCHEMBL10077180 | 0.73 | — | — | |
| SCHEMBL25604749 | 0.73 | — | — | |
| SCHEMBL18233634 | 0.73 | SMN1; SMN2 (0.47) | — | |
| SCHEMBL2372570 | 0.71 | — | — | |
| SCHEMBL6776221 | 0.71 | — | — | |
| SCHEMBL14093811 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 94 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118880332-B | Acidic etching solution for etching copper foil and preparation method thereof | 深圳市京中康科技有限公司 | 2025-06-03 | — | — | CN | claimed |
| CN-118880332-A | Acidic etching solution for etching copper foil and preparation method thereof | 深圳市京中康科技有限公司 | 2024-11-01 | — | — | CN | claimed |
| CN-116497355-B | Acidic copper etching solution and application thereof | 珠海市裕洲环保科技有限公司 | 2024-03-22 | — | — | CN | claimed |
| EP-2457940-B1 | Fluorinated supramolecular polymers | SUPRAPOLIX BV (NL) | 2018-10-24 | — | — | EP | claimed |
| CN-104603242-B | Breaking compositionss and using method | 通用电气公司 | 2017-03-08 | — | — | CN | claimed |
| CN-104603242-A | Demulsifying compositions and methods of use | GEN ELECTRIC | 2015-05-06 | — | — | CN | claimed |
| EP-1641724-B1 | SIZING COMPOSITION FOR THERMOPLASTIC REINFORCEMENT | OCV INTELLECTUAL CAPITAL LLC (US) | 2012-08-08 | — | — | EP | claimed |
| US-20120136120-A1 | FLUORINATED SUPRAMOLECULAR POLYMERS | SUPRAPOLIX B.V. | 2012-05-31 | — | — | US | claimed |
| EP-2457940-A1 | Fluorinated supramolecular polymers | SupraPolix B.V. (NL) | 2012-05-30 | — | — | EP | claimed |
| CN-102015865-A | Color stable thermoplastic composition | DSM IP ASSETS BV | 2011-04-13 | — | — | CN | claimed |
| CN-1805910-A | Sizing composition for thermoplastic material reinforcement | OWENS CORNING COMPOSITES SPRL (BE) | 2006-07-19 | — | — | CN | claimed |
| EP-1641724-A1 | SIZING COMPOSITION FOR THERMOPLASTIC REINFORCEMENT | Owens Corning Composites S.P.R.L. (BE) | 2006-04-05 | — | — | EP | claimed |
| WO-2004110948-A1 | SIZING COMPOSITION FOR THERMOPLASTIC REINFORCEMENT | OWENS CORNING COMPOSITES S.P.R.L. (BE) | 2004-12-23 | — | — | WO | claimed |
| US-20040258912-A1 | Sizing composition for thermoplastic reinforcement | OC NL INVEST COOPERATIEF U.A. (NL) | 2004-12-23 | — | — | US | claimed |
| US-20040224521-A1 | Method to passivate conductive surfaces during semiconductor processing | NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC. (NL) | 2004-11-11 | — | — | US | claimed |
| US-5795696-A | Laminatable backing substrates containing paper desizing agents | XEROX CORPORATION (US) | 1998-08-18 | — | — | US | claimed |
| US-5746814-A | Decurling compositions | XEROX CORPORATION (US) | 1998-05-05 | — | — | US | claimed |
| EP-0518490-B1 | Ink jet compositions containing desizing agents | XEROX CORP (US) | 1998-02-25 | — | — | EP | claimed |
| US-5211747-A | INK JET INK COMPOSITIONS CONTAINING DESIZING AGENTS | XEROX CORPORATION (US) | 1993-05-18 | — | — | US | claimed |
| EP-0518490-A1 | Ink jet compositions containing desizing agents | XEROX CORPORATION (US) | 1992-12-16 | — | — | EP | claimed |