SCHEMBL452954

SCHEMBL452954

FOF.[Cu]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17798804 0.91
SCHEMBL45345 0.89
Charcoal, Activated SCHEMBL3115984 0.80
SCHEMBL1116316 0.80
Magnesium SCHEMBL224831 0.80
SCHEMBL23878703 0.80
SCHEMBL17699235 0.80
SCHEMBL10611491 0.80
SCHEMBL20952051 0.80
SCHEMBL154001 0.80

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 105 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230327181-A1 STABILIZATION OF LI-ION BATTERY ANODES GEORGIA TECH RESEARCH CORPORATION 2023-10-12 US claimed
CN-115667192-A Process for producing vinyl fluoride 大金工业株式会社 2023-01-31 CN claimed
EP-3227942-A1 NANOCOMPOSITE PARTICLES OF CONVERSION CHEMISTRY AND MIXED ELECTRONIC IONIC CONDUCTOR MATERIALS QuantumScape Corporation (US) 2017-10-11 EP claimed
US-7176119-B2 Method of fabricating copper damascene and dual damascene interconnect wiring INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2007-02-13 US claimed
EP-1198848-A1 COATED CONDUCTOR THICK FILM PRECURSOR American Superconductor Corporation (US) 2002-04-24 EP claimed
WO-2001008236-A1 COATED CONDUCTOR THICK FILM PRECURSOR AMERICAN SUPERCONDUCTOR CORPORATION (US) 2001-02-01 WO claimed
US-20260135091-A1 ELECTRODES, LITHIUM-ION BATTERIES, AND METHODS OF MAKING AND USING SAME SILA NANOTECHNOLOGIES INC (US) 2026-05-14 US disclosed
US-12537190-B2 Electrodes, lithium-ion batteries, and methods of making and using same SILA NANOTECHNOLOGIES, INC. (US) 2026-01-27 US disclosed
US-20250305171-A1 MATERIAL COMPONENTS PROTECTION AGAINST THE CORROSIVE ACTION CRYOLITE MELTS IN ALUMINIUM REDUCTION CELLS GONTHIER GHISLAIN (CA) 2025-10-02 US disclosed
US-12366003-B2 Material components protection against the corrosive action cryolite melts in aluminium reduction cells Gonthier, Ghislain (CA) 2025-07-22 US disclosed
CN-114999918-B Display panel and preparation method thereof 深圳市华星光电半导体显示技术有限公司 2025-01-10 CN disclosed
CN-114999918-B Display panel and preparation method thereof 深圳市华星光电半导体显示技术有限公司 2025-01-10 CN disclosed
US-20240282934-A1 ELECTRODES, LITHIUM-ION BATTERIES, AND METHODS OF MAKING AND USING SAME GEORGIA TECH RESEARCH CORPORATION 2024-08-22 US disclosed
US-5892135-A FROM CHLOROFLUOROETHANES, RUTHENIUM, COPPER, NICKEL OR CHROMIUM OR OXIDES, HALIDES OR OXYHALIDES OF THESE METALS AS CATALYSTS E. I. DU PONT DE NEMOURS AND COMPANY (US) 1999-04-06 US disclosed
WO-1998037043-A2 PROCESSES FOR THE MANUFACTURE OF 1,1,1,3,3-PENTAFLUOROPROPENE, 2-CHLORO-PENTAFLUOROPROPENE AND COMPOSITIONS COMPRISING SATURATED DERIVATIVES THEREOF E.I. DU PONT DE NEMOURS AND COMPANY (US) 1998-08-27 WO disclosed
EP-0729397-B1 FLUXLESS SOLDERING PRETREATING SYSTEM AND METHOD USING FLUORINE-CONTAINING PLASMA MCNC (US) 1998-06-10 EP disclosed
EP-0729397-A1 FLUXLESS SOLDERING PRETREATING SYSTEM AND METHOD USING FLUORINE-CONTAINING PLASMA MCNC (US) 1996-09-04 EP disclosed
US-5499754-A Fluxless soldering sample pretreating system MCNC (US) 1996-03-19 US disclosed
WO-1995013896-A1 FLUXLESS SOLDERING PRETREATING SYSTEM AND METHOD USING FLUORINE-CONTAINING PLASMA MCNC (US) 1995-05-26 WO disclosed
US-5407121-A Surface of copper layer is pretreated with fluorine containing plasma which react with copper oxide film forming copper oxyfluoride permitting solder wetting, placing tin or tin-lead alloy on pretreated surface, reflowing MCNC (US) 1995-04-18 US disclosed