SCHEMBL453162

SCHEMBL453162

CCCC(=O)CC(=O)[O-].CCCC(=O)CC(=O)[O-].CCCCO[Zr+2]OCCCC

nearest known ligand 0.39

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
CA1 P00915 1/20 0.39
FFAR3 O14843 2/20 0.39
HDAC3 O15379 2/20 0.39
HDAC1 Q13547 2/20 0.39
HDAC2 Q92769 2/20 0.39
HDAC8 Q9BY41 2/20 0.39
HAO1 Q9UJM8 1/20 0.37
CES2 O00748 6/20 0.34
CES1 P23141 6/20 0.34
ALDH1A1 P00352 1/20 0.34
FABP3 P05413 3/20 0.33
CA2 P00918 1/20 0.33
ATM Q13315 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29408744 0.98 CA1 (0.38) CA1FFAR3HDAC3HDAC1HDAC2
SCHEMBL17105987 0.93 CA1 (0.44) CA1FFAR3HDAC3HDAC1HDAC2
SCHEMBL17106051 0.92 HAO1 (0.47) CA1HAO1CES2CES1FABP3
SCHEMBL17106079 0.90 HAO1 (0.50) HAO1CES2CES1FABP3
SCHEMBL17106148 0.89 HDAC3 (0.41) CA1FFAR3HDAC3HDAC1HDAC2
SCHEMBL17105995 0.88 CA1 (0.36) CA1FFAR3HDAC3HDAC1HDAC2
SCHEMBL17106090 0.86 CA1 (0.44) CA1FFAR3HDAC3HDAC1HDAC2
Butyric Acid SCHEMBL30339117 0.85 FFAR3 (0.56) CA1FFAR3HDAC3HDAC1HDAC2
SCHEMBL17106071 0.85 HAO1 (0.47) CA1HAO1CES2CES1FABP3
SCHEMBL1361434 0.85 PAOX (0.34) CA1FFAR3HDAC3HDAC1HDAC2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 76 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12503612-B2 Fluorine-containing alcohol composite UNIMATEC CO., LTD. (JP) 2025-12-23 US disclosed
EP-4660250-A1 ROOM-TEMPERATURE-CURABLE SILICONE COMPOSITION Momentive Performance Materials Japan LLC (JP) 2025-12-10 EP disclosed
US-20250163206-A1 SILOXANE-MODIFIED POLYURETHANE COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-05-22 US disclosed
US-12305084-B2 Adhesive polyorganosiloxane composition MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC (JP) 2025-05-20 US disclosed
EP-4488308-A1 SILOXANE-MODIFIED POLYURETHANE COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-01-08 EP disclosed
US-12180397-B2 Polyorganosiloxane composition for use in adhesion of a polyphenylene sulfide resin MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC (JP) 2024-12-31 US disclosed
US-20240376251-A1 SILOXANE-MODIFIED POLYURETHANE COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-11-14 US disclosed
US-20240343867-A1 ULTRAVIOLET RAY-ACTIVATED LIQUID SILICONE COMPOSITION FOR OPTICAL APPLICATION MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2024-10-17 US disclosed
EP-4414399-A1 SILOXANE-MODIFIED POLYURETHANE COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-08-14 EP disclosed
WO-2024162022-A1 ROOM-TEMPERATURE-CURABLE SILICONE COMPOSITION モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 2024-08-08 WO disclosed
US-20100190018-A1 PROCESS FOR PRODUCING NITRILE RUBBER-METAL LAMINATE NOK CORPORATION (JP) 2010-07-29 US disclosed
US-20100143712-A1 SILANE-CROSSLINKING ADHESIVE OR SEALANT COMPRISING N-SILYLALKYLAMIDES AND USE THEREOF HENKEL AG & CO. KGAA (DE) 2010-06-10 US disclosed
EP-2174723-A1 METHOD FOR PRODUCING NITRILE RUBBER METAL LAMINATE NOK Corporation (JP) 2010-04-14 EP disclosed
US-20100081757-A1 COMPOSITIONS CONSISTING OF PARTIALLY SILYL-TERMINATED POLYMERS HENKEL AG & CO. KGAA (DE) 2010-04-01 US disclosed
EP-1659160-B1 PRIMER FOR VULCANIZATION BONDING NOK CORP (JP) 2009-07-08 EP disclosed
EP-2030777-A1 RUBBER-METAL LAMINATE NOK Corporation (JP) 2009-03-04 EP disclosed
EP-1920917-A1 PRIMER COMPOSITION AND METAL-RUBBER LAMINATE USING SAME NOK Corporation (JP) 2008-05-14 EP disclosed
US-7311978-B2 Primer for vulcanization bonding NOK CORPORATION (JP) 2007-12-25 US disclosed
US-20060251908-A1 Primer for vulcanization bonding NOK CORPORATION (JP) 2006-11-09 US disclosed
EP-1659160-A1 PRIMER FOR VULCANIZATION BONDING NOK Corporation (JP) 2006-05-24 EP disclosed