SCHEMBL4551097

SCHEMBL4551097

O=P(O)(O)C1CC2CCC1C2

nearest known ligand 0.35

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
POLB P06746 2/20 0.35
EPHX2 P34913 2/20 0.32
ATM Q13315 1/20 0.32
EPHX1 P07099 1/20 0.32
TAS1R3 Q7RTX0 1/20 0.31
TAS1R1 Q7RTX1 1/20 0.31
TAS1R2 Q8TE23 1/20 0.31
GAA P10253 1/20 0.30
MEN1 O00255 1/20 0.30
NPC1 O15118 1/20 0.30
RAB9A P51151 1/20 0.30
KMT2A Q03164 1/20 0.30
L3MBTL1 Q9Y468 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4551476 0.88 GAA (0.31) GAA
SCHEMBL969703 0.86 POLB (0.35) POLBEPHX2ATMEPHX1TAS1R3
SCHEMBL7079807 0.82 POLB (0.33) POLBEPHX2ATMEPHX1
SCHEMBL3072421 0.80 POLB (0.33) POLBEPHX2
SCHEMBL7081583 0.76 MAPT (0.32) POLBL3MBTL1
SCHEMBL7079747 0.76 POLB (0.31) POLB
SCHEMBL4407143 0.76 EPHX2 (0.32) POLBEPHX2
SCHEMBL6683794 0.73 MAPT (0.30)
SCHEMBL6831206 0.73
SCHEMBL6685313 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119978387-A Three-component synthesis method of polyphosphonate 华南理工大学 2025-05-13 CN claimed
CN-119978387-A Three-component synthesis method of polyphosphonate 华南理工大学 2025-05-13 CN disclosed
US-20250133947-A1 Thermal Evaporation-Growth of Halide Perovskites Through Phosphonic Acid Addition GEORGIA TECH RES INST (US) 2025-04-24 US disclosed
US-20210363391-A1 PRESSURE-SENSITIVE ADHESIVE LAYER, OPTICAL FILM HAVING PRESSURE-SENSITIVE ADHESIVE LAYER, OPTICAL LAMINATE, AND IMAGE DISPLAY DEVICE NITTO DENKO CORPORATION (JP) 2021-11-25 US disclosed
CN-108774485-B Acrylic pressure-sensitive adhesive composition, acrylic pressure-sensitive adhesive layer, pressure-sensitive adhesive layer-attached base film, laminate, and image display device 日东电工株式会社 2020-07-28 CN disclosed
CN-105738998-B Polarizing film with coating layer, polarizing film with adhesive layer, and image display device 日东电工株式会社 2020-06-16 CN disclosed
US-10253220-B2 Acrylic pressure-sensitive adhesive composition, acrylic pressure-sensitive adhesive layer, pressure-sensitive adhesive layer-attached substrate film, laminate, and image display device NITTO DENKO CORPORATION (JP) 2019-04-09 US disclosed
US-20160326402-A1 ACRYLIC PRESSURE-SENSITIVE ADHESIVE COMPOSITION, ACRYLIC PRESSURE-SENSITIVE ADHESIVE LAYER, PRESSURE-SENSITIVE ADHESIVE LAYER-ATTACHED SUBSTRATE FILM, LAMINATE, AND IMAGE DISPLAY DEVICE NITTO DENKO CORPORATION (JP) 2016-11-10 US disclosed
US-7635748-B2 Resin and article molded therefrom TORAY INDUSTRIES, INC. (JP) 2009-12-22 US disclosed
US-7442757-B2 Resin, resin composition, method for manufacturing the same, and molded material including the same TORAY INDUSTRIES, INC. (JP) 2008-10-28 US disclosed
US-20080139778-A1 Resin and article molded therefrom TAKANISHI KEIJIRO 2008-06-12 US disclosed
CN-100334138-C Resin, resin compositions, process for production thereof, and moldings made by using the same TORAY INDUSTRIES (JP) 2007-08-29 CN disclosed
US-20060287464-A1 Resin and article molded therefrom TORAY INDUSTRIES, INC. (JP) 2006-12-21 US disclosed
EP-1640405-A1 RESIN AND ARTICLE MOLDED THEREFROM TORAY INDUSTRIES, INC. (JP) 2006-03-29 EP disclosed
US-20060047104-A1 Resin, resin composition, process for production thereof, and moldings made by using the same TORAY INDUSTRIES, INC. (JP) 2006-03-02 US disclosed
CN-1649940-A Resin, resin compositions, process for production thereof, and moldings made by using the same TORAY INDUSTRIES (JP) 2005-08-03 CN disclosed
EP-1518884-A1 RESIN, RESIN COMPOSITIONS, PROCESS FOR PRODUCTION THEREOF, AND MOLDINGS MADE BY USING THE SAME TORAY INDUSTRIES, INC. (JP) 2005-03-30 EP disclosed