SCHEMBL4551553

SCHEMBL4551553

CCCCC(CC)COOOC(C)(C)CCC(C)(C)OOOCC(CC)CCCC

nearest known ligand 0.43

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 6/20 0.43
L3MBTL1 Q9Y468 1/20 0.43
TSHR P16473 4/20 0.40
TDP1 Q9NUW8 3/20 0.40
ATM Q13315 1/20 0.40
ALDH1A1 P00352 7/20 0.38
CA2 P00918 4/20 0.36
RECQL P46063 1/20 0.34
LMNA P02545 2/20 0.33
MMP9 P14780 1/20 0.33
MMP8 P22894 1/20 0.33
MMP14 P50281 1/20 0.33
MAPK1 P28482 1/20 0.32
HSD17B10 Q99714 1/20 0.32
PRSS1 P07477 1/20 0.31
PRSS2 P07478 1/20 0.31
PRSS3 P35030 1/20 0.31
CA1 P00915 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1302977 0.89 CYP3A4 (0.46) CYP3A4L3MBTL1TSHRTDP1ATM
SCHEMBL27500525 0.86 CYP3A4 (0.46) CYP3A4L3MBTL1TSHRTDP1ATM
SCHEMBL28858706 0.85 CYP3A4 (0.42) CYP3A4L3MBTL1TSHRTDP1ATM
SCHEMBL10448343 0.81 CYP3A4 (0.55) CYP3A4L3MBTL1TSHRTDP1ATM
SCHEMBL28858716 0.81 CYP3A4 (0.44) CYP3A4L3MBTL1TSHRTDP1ATM
SCHEMBL502643 0.79 CYP3A4 (0.46) CYP3A4L3MBTL1TSHRTDP1ATM
SCHEMBL29460338 0.78 CYP3A4 (0.48) CYP3A4L3MBTL1TSHRTDP1ATM
SCHEMBL8709004 0.78 CYP3A4 (0.48) CYP3A4L3MBTL1TSHRTDP1ATM
SCHEMBL5198521 0.77 CYP3A4 (0.59) CYP3A4L3MBTL1TSHRTDP1ATM
SCHEMBL4271486 0.76 CYP3A4 (0.42) CYP3A4L3MBTL1TSHRTDP1ATM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-103897281-B Thermoplastic resin composition and molded article CHI MEI CORP. (CN) 2016-05-11 CN disclosed
CN-103087274-B Transparent rubber modified styrene resin CHI MEI CORP. (CN) 2015-11-18 CN disclosed
CN-103183762-B Styrene-alpha-methylstyrene-acrylonitrile copolymer and rubber-modified styrene resin CHI MEI CORP. (CN) 2015-08-05 CN disclosed
CN-104610694-A Styrene resin composition and molded article obtained therefrom CHI MEI CORP 2015-05-13 CN disclosed
US-8227361-B2 Prepreg and printed wiring board using thin quartz glass cloth HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-07-24 US disclosed
US-20090266591-A1 Prepreg and printed wiring board using thin quartz glass cloth RESONAC CORPORATION (JP) 2009-10-29 US disclosed
CN-101205274-A Rubber modified styrene resin composition CHI MEI CORP (CN) 2008-06-25 CN disclosed
US-6855769-B2 Thermoplastic styrenic resin composition CHI MEI CORPORATION (TW) 2005-02-15 US disclosed
US-20040102579-A1 Thermoplastic styrenic resin composition SU WEN-YI (TW) 2004-05-27 US disclosed
US-6515072-B2 Rubbery block copolymer particle dispersed phase of styrene monomers and dienic monomers; and copolymer matrix with styrenic, (meth)acrylate, and vinyl cyanide units CHI MEI CORPORATION (TW) 2003-02-04 US disclosed
US-20020032282-A1 Transparent rubber-modified styrenic resin composition CHI MEI CORPORATION (TW) 2002-03-14 US disclosed
US-4595734-A Reaction product of epoxide resin, vinyl ester resin, polyfunctional amine INTERPLASTIC CORPORATION (US) 1986-06-17 US disclosed