Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA4 | P22748 | 6/20 | 0.50 |
| ▸ | OR51E2 | Q9H255 | 1/20 | 0.44 |
| ▸ | CASP1 | P29466 | 1/20 | 0.44 |
| ▸ | FFAR3 | O14843 | 2/20 | 0.39 |
| ▸ | HDAC3 | O15379 | 2/20 | 0.39 |
| ▸ | HDAC1 | Q13547 | 2/20 | 0.39 |
| ▸ | HDAC2 | Q92769 | 2/20 | 0.39 |
| ▸ | HDAC8 | Q9BY41 | 2/20 | 0.39 |
| ▸ | CA1 | P00915 | 3/20 | 0.36 |
| ▸ | FAHD1 | Q6P587 | 1/20 | 0.36 |
| ▸ | CA2 | P00918 | 1/20 | 0.35 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.33 |
| ▸ | MAPT | P10636 | 1/20 | 0.33 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.33 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Glycolic Acid SCHEMBL331529 | 0.91 | CA4 (0.50) | CA4OR51E2CASP1FFAR3HDAC3 | |
| Glycolic Acid SCHEMBL14661525 | 0.91 | CA4 (0.50) | CA4OR51E2CASP1FFAR3HDAC3 | |
| Glycolic Acid SCHEMBL4522823 | 0.91 | CA4 (0.50) | CA4OR51E2CASP1FFAR3HDAC3 | |
| Glycolic Acid SCHEMBL10878578 | 0.91 | CA4 (0.50) | CA4OR51E2CASP1FFAR3HDAC3 | |
| Glycolic Acid SCHEMBL21297631 | 0.91 | CA4 (0.50) | CA4OR51E2CASP1FFAR3HDAC3 | |
| Glycolic Acid SCHEMBL991430 | 0.91 | — | — | |
| Glycolic Acid SCHEMBL26512 | 0.91 | CA4 (0.50) | CA4OR51E2CASP1FFAR3HDAC3 | |
| Glycolic Acid SCHEMBL15441504 | 0.91 | CA4 (0.50) | CA4OR51E2CASP1FFAR3HDAC3 | |
| Glycolic Acid SCHEMBL1002389 | 0.91 | CA4 (0.50) | CA4OR51E2CASP1FFAR3HDAC3 | |
| Glycolic Acid SCHEMBL1407330 | 0.91 | CA4 (0.50) | CA4OR51E2CASP1FFAR3HDAC3 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 76 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2001086038-A2 | PHOTONIC BANDGAP MATERIALS BASED ON GERMANIUM | UNIVERSIDAD POLITECNICA DE VALENCIA (ES) | 2001-11-15 | — | — | WO | claimed |
| US-20240400895-A1 | SEMICONDUCTOR NANOPARTICLES, METHOD FOR PRODUCING SEMICONDUCTOR NANOPARTICLES, AND LIGHT EMITTER | NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM (JP) | 2024-12-05 | — | — | US | disclosed |
| CN-118076673-A | Polyester film, flexible flat cable and wire harness | 爱思开迈克沃有限公司 | 2024-05-24 | — | — | CN | disclosed |
| WO-2023157483-A1 | SEMICONDUCTOR NANOPARTICLES, METHOD FOR PRODUCING SEMICONDUCTOR NANOPARTICLES, AND LIGHT EMITTER | 国立大学法人東海国立大学機構 | 2023-08-24 | — | — | WO | disclosed |
| WO-2023043068-A1 | POLYESTER FILM, FLEXIBLE FLAT CABLE, AND WIRE HARNESS | 에스케이씨 주식회사 | 2023-03-23 | — | — | WO | disclosed |
| EP-3733768-B1 | POLYESTER RESIN COMPOSITION FOR CALENDERING, AND METHOD FOR PRODUCING POLYESTER FILM | SKC CO LTD (KR) | 2022-11-02 | — | — | EP | disclosed |
| EP-3348618-B1 | HEAT-CONDUCTIVE RESIN COMPOSITION | KANEKA CORP (JP) | 2021-12-29 | — | — | EP | disclosed |
| EP-2843000-B1 | A MOLDING COMPRISING A POLYCARBONATE RESIN COMPOSITION WITH SUPERIOR FLUIDITY AND A METHOD OF PRODUCING THE SAME | KANEKA CORP (JP) | 2021-10-06 | — | — | EP | disclosed |
| EP-3305519-B1 | METAL RESIN COMPOSITE | KANEKA CORP (JP) | 2021-06-30 | — | — | EP | disclosed |
| CN-108026375-B | Thermally conductive resin composition | 株式会社钟化 | 2021-05-11 | — | — | CN | disclosed |
| US-5886088-A | A BLENDS OF MOLDING MATERIAL COMPRISING AN EPOXY COMPOUND OR RESIN AND A POLYFUNCTIONAL CARBODIIMIDE COMPOUND TO IMPROVE THE MOIST HEAT RESISTANCE, FLUIDITY AND MECHANICAL STRENGTH | KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 1999-03-23 | — | — | US | disclosed |
| US-5866672-A | HALOGEN FLAME RETARDANT, EPOXY COMPOUNDS OR CARBODIIMIDE COMPOUNDS AND AN ANTIMONY COMPOUND | KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 1999-02-02 | — | — | US | disclosed |
| EP-0861873-A1 | POLYCARBONATE RESIN COMPOSITION | KANEKA CORPORATION (JP) | 1998-09-02 | — | — | EP | disclosed |
| EP-0764692-A1 | POLYETHYLENE TEREPHTHALATE RESIN COMPOSITION | KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 1997-03-26 | — | — | EP | disclosed |
| EP-0763567-A1 | FLAME-RETARDANT POLYETHYLENE TEREPHTHALATE RESIN COMPOSITIONS | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha (JP) | 1997-03-19 | — | — | EP | disclosed |
| EP-0386256-B1 | AROMATIC POLYESTER RESIN COMPOSITION AND FIBERS THEREOF | TEIJIN LTD (JP) | 1996-05-01 | — | — | EP | disclosed |
| EP-0409288-B1 | Shrinkable polyester film | DIAFOIL HOECHST CO LTD (JP) | 1996-02-28 | — | — | EP | disclosed |
| US-5331032-A | Hydrophilic aromatic polyester fiber | TEIJIN LIMITED (JP) | 1994-07-19 | — | — | US | disclosed |
| US-5262460-A | Blend with polyoxyethylene glycol for antistatic fibers, films or sheets | TEIJIN LIMITED (JP) | 1993-11-16 | — | — | US | disclosed |
| EP-0386256-A1 | AROMATIC POLYESTER RESIN COMPOSITION AND FIBERS THEREOF | TEIJIN LIMITED (JP) | 1990-09-12 | — | — | EP | disclosed |