⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6764852 | 1.00 | — | — | |
| SCHEMBL10018790 | 1.00 | — | — | |
| SCHEMBL19166455 | 1.00 | — | — | |
| SCHEMBL4570329 | 1.00 | — | — | |
| SCHEMBL4570330 | 1.00 | — | — | |
| SCHEMBL15025642 | 1.00 | — | — | |
| SCHEMBL12869963 | 1.00 | — | — | |
| SCHEMBL12573973 | 1.00 | — | — | |
| SCHEMBL6764850 | 1.00 | — | — | |
| SCHEMBL12203028 | 1.00 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9698077-B2 | Heat conductive silicone composition based on combination of components, heat conductive layer, and semiconductor device | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-07-04 | — | — | US | disclosed |
| US-20150357261-A1 | HEAT CONDUCTIVE SILICONE COMPOSITION, HEAT CONDUCTIVE LAYER, AND SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2015-12-10 | — | — | US | disclosed |
| US-8883913-B2 | Resin composition, resin film, semiconductor device, and production method thereof | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-11-11 | — | — | US | disclosed |
| US-8673537-B2 | Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-03-18 | — | — | US | disclosed |
| US-20130146939-A1 | SILICONE ADHESIVE FOR SEMICONDUCTOR ELEMENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-06-13 | — | — | US | disclosed |
| US-20130113083-A1 | RESIN COMPOSITION, RESIN FILM, SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD THEREOF | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-05-09 | — | — | US | disclosed |
| US-8383005-B2 | Thermally conductive silicone grease composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-02-26 | — | — | US | disclosed |
| US-20120119137-A1 | THERMALLY CONDUCTIVE SILICONE GREASE COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-05-17 | — | — | US | disclosed |
| US-20110143103-A1 | PHOTO-CURABLE RESIN COMPOSITION, PATTERN FORMING METHOD AND SUBSTRATE PROTECTING FILM, AND FILM-SHAPED ADHESIVE AND ADHESIVE SHEET USING SAID COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-06-16 | — | — | US | disclosed |