SCHEMBL457682

SCHEMBL457682

C=C(C)C(=O)OCCCCCCC(C)COC(=O)C(=C)C

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.59
POLB P06746 1/20 0.46
APEX1 P27695 1/20 0.46
HTT P42858 1/20 0.46
TDP1 Q9NUW8 1/20 0.46
THRB P10828 1/20 0.43
ALDH1A1 P00352 4/20 0.34
FAAH O00519 1/20 0.33
CYP3A4 P08684 2/20 0.32
ACE2 Q9BYF1 1/20 0.32
USP2 O75604 1/20 0.31
MAPT P10636 1/20 0.31
HPGD P15428 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
NAAA Q02083 1/20 0.31
LMNA P02545 1/20 0.30
APOBEC3A P31941 1/20 0.30
APOBEC3G Q9HC16 1/20 0.30
RAD52 P43351 1/20 0.30
NPSR1 Q6W5P4 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5827954 0.94 TSHR (0.53) TSHRPOLBAPEX1HTTTDP1
SCHEMBL31180298 0.94 TSHR (0.71) TSHRPOLBAPEX1HTTTDP1
SCHEMBL28387209 0.93 TSHR (0.62) TSHRPOLBAPEX1HTTTDP1
SCHEMBL6066276 0.87 TSHR (0.59) TSHRPOLBAPEX1HTTTDP1
SCHEMBL652336 0.87 TSHR (0.59) TSHRTHRBFAAHACE2MAPT
SCHEMBL650080 0.87 TSHR (0.59) TSHRTHRBFAAHACE2MAPT
SCHEMBL6455857 0.87 TSHR (0.59) TSHRTHRBFAAHACE2MAPT
SCHEMBL6748216 0.87 TSHR (0.59) TSHRTHRBFAAHACE2MAPT
SCHEMBL154842 0.87 TSHR (0.55) TSHRPOLBAPEX1HTTTDP1
SCHEMBL8204683 0.87 TSHR (0.59) TSHRTHRBFAAHACE2MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 175 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2881163-A1 Composite membrane Gambro Lundia AB (SE) 2015-06-10 EP claimed
US-7956147-B2 comprising polymerizing hydrophobic monomer to form particulate resin exhibiting molecular weight of from 20,000 to 500,000, dispersing the particulate resin in an aqueous medium to form a resin particle dispersion and adding thereto a hydrophobic cross-linkable monomer KONICA MINOLTA BUSINESS TECHNOLOGIES, INC. (JP) 2011-06-07 US claimed
US-20080269447-A1 comprising polymerizing hydrophobic monomer to form particulate resin exhibiting molecular weight of from 20,000 to 500,000, dispersing the particulate resin in an aqueous medium to form a resin particle dispersion and adding thereto a hydrophobic cross-linkable monomer KONICA MINOLTA BUSINESS TECHNOLOGIES, INC. (JP) 2008-10-30 US claimed
US-12384099-B2 Dual cure epoxy formulations for 3D printing applications HENKEL AG & CO. KGAA (DE) 2025-08-12 US disclosed
US-20250155808-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN ZEON CORPORATION (JP) 2025-05-15 US disclosed
EP-4526365-A1 ACRYLATE-EPOXY RESIN COMPOSITIONS Lyondellbasell Composites LLC (US) 2025-03-26 EP disclosed
US-12227024-B2 Writing implement MITSUBISHI PENCIL COMPANY, LIMITED (JP) 2025-02-18 US disclosed
US-12215246-B2 Composition comprising a light-weight filler HENKEL AG & CO. KGAA (DE) 2025-02-04 US disclosed
WO-2025024186-A1 LATENT ACRYLIC ADHESIVE HUNTSMAN ADVANCED MATERIALS AMERICAS LLC (US) 2025-01-30 WO disclosed
WO-2024143072-A1 COMPOSITION AND CURED PRODUCT 株式会社ADEKA 2024-07-04 WO disclosed
US-20240132687-A1 Thermally expandable compositions comprising wax HENKEL AG & CO KGAA (DE) 2024-04-25 US disclosed
US-20030055166-A1 Thermoplastic resin compostion and poduction processes thereof RIKEN TECHNOS CORPORATION (JP) 2003-03-20 US disclosed
EP-1266915-A1 THERMOPLASTIC RESIN COMPOSITIONS AND PRODUCTION PROCESSES THEREOF Riken Technos Corporation (JP) 2002-12-18 EP disclosed
US-6458893-B1 SAPONIFIED ETHYLENE-VINYL ACETATE COPOLYMER OF SPECIFIED ETHYLENE CONTENT AND DEGREE OF SAPONIFICATION AND AN OPTIONALLY HYDROGENATED COPOLYMER OF A VINYL AROMATIC SUCH AS STYRENE WITH A CONJUGATED DIENE SUCH AS ISOPRENE; MOLDABILITY RIKEN VINYL INDUSTRY CO., LTD. (JP) 2002-10-01 US disclosed
EP-1203790-A1 PARTICULATE THERMOPLASTIC ELASTOMER RESIN FOR POWDER MOLDING RIKEN VINYL INDUSTRY CO., LTD. (JP) 2002-05-08 EP disclosed
US-20020028882-A1 Thermoplastic resin composition RIKEN TECHNOS CORPORATION (JP) 2002-03-07 US disclosed
EP-1176168-A2 Thermoplastic resin composition RIKEN VINYL INDUSTRY CO., LTD. (JP) 2002-01-30 EP disclosed
US-20010021747-A1 Composition derived from a softening agent and a thermoplastic resin composition containing the same RIKEN TECHNOS CORPORATION (JP) 2001-09-13 US disclosed
EP-1127915-A1 Composition derived from a softening agent and a thermoplastic resin composition containing the same RIKEN VINYL INDUSTRY CO., LTD. (JP) 2001-08-29 EP disclosed
EP-1086991-A1 Thermoplastic elastomeric resin composition and a granule thereof RIKEN VINYL INDUSTRY CO., LTD. (JP) 2001-03-28 EP disclosed