Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TP53 | P04637 | 1/20 | 0.41 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.37 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.37 |
| ▸ | MME | P08473 | 3/20 | 0.35 |
| ▸ | ACE | P12821 | 1/20 | 0.35 |
| ▸ | CPA1 | P15085 | 1/20 | 0.35 |
| ▸ | ACE2 | Q9BYF1 | 1/20 | 0.35 |
| ▸ | APAF1 | O14727 | 1/20 | 0.34 |
| ▸ | FAAH | O00519 | 1/20 | 0.33 |
| ▸ | NR4A2 | P43354 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4582880 | 1.00 | TP53 (0.41) | TP53CYP2D6CYP2C19MMEACE | |
| SCHEMBL29178917 | 0.98 | TP53 (0.39) | TP53CYP2D6CYP2C19MMEACE | |
| SCHEMBL29178997 | 0.98 | TP53 (0.39) | TP53CYP2D6CYP2C19MMEACE | |
| SCHEMBL28674291 | 0.98 | TP53 (0.39) | TP53CYP2D6CYP2C19MMEACE | |
| SCHEMBL2559274 | 0.85 | TP53 (0.41) | TP53CYP2D6CYP2C19MMEACE | |
| SCHEMBL10084435 | 0.85 | TP53 (0.41) | TP53CYP2D6CYP2C19MMEACE | |
| SCHEMBL22887450 | 0.85 | TP53 (0.41) | TP53CYP2D6CYP2C19MMEACE | |
| SCHEMBL6374401 | 0.85 | TP53 (0.41) | TP53CYP2D6CYP2C19MMEACE | |
| SCHEMBL574633 | 0.82 | CYP2D6 (0.50) | TP53CYP2D6CYP2C19MMEACE | |
| SCHEMBL10954429 | 0.82 | CYP2D6 (0.50) | TP53CYP2D6CYP2C19MMEACE |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110511350-B | Polycarbon type waterborne polyurethane and preparation method thereof | 华南理工大学 | 2021-10-26 | — | — | CN | claimed |
| CN-107148435-B | Hydroxyl group-containing polyurethane resin, and urethane (meth) acrylate resin | 昭和电工株式会社 | 2020-10-13 | — | — | CN | claimed |
| CN-119095892-A | Polyurethane aqueous dispersion, adhesive, synthetic artificial leather and paint | 大日精化工业株式会社 | 2024-12-06 | — | — | CN | disclosed |
| CN-119095893-A | Polyurethane aqueous dispersion, adhesive, synthetic artificial leather and paint | 大日精化工业株式会社 | 2024-12-06 | — | — | CN | disclosed |
| CN-118791842-A | Conductive resin composition and antistatic agent | DIC株式会社 | 2024-10-18 | — | — | CN | disclosed |
| CN-117063247-A | Transparent conductive film and method for forming transparent conductive pattern | 株式会社力森诺科 | 2023-11-14 | — | — | CN | disclosed |
| CN-117043890-A | Transparent conductive film and method for forming transparent conductive pattern | 株式会社力森诺科 | 2023-11-10 | — | — | CN | disclosed |
| CN-114599699-B | Polycarbodiimide compound, aqueous resin composition, and food packaging container | 日清纺化学株式会社 | 2023-09-22 | — | — | CN | disclosed |
| CN-113207292-B | Water-based polyurethane dispersions and their preparation | 陶氏环球技术有限责任公司 | 2023-09-19 | — | — | CN | disclosed |
| CN-116325027-A | Transparent conductive film laminate | 株式会社力森诺科 | 2023-06-23 | — | — | CN | disclosed |
| CN-116261574-A | Novel polyurethanes and their use in pharmaceutical dosage forms | 巴斯夫欧洲公司 | 2023-06-13 | — | — | CN | disclosed |
| EP-1957552-A1 | THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN COMPOSITION SOLUTION, FILM FORMING MATERIAL AND THEIR CURED PRODUCT | Showa Denko K.K. (JP) | 2008-08-20 | — | — | EP | disclosed |
| EP-1937776-A2 | HEAT-CURABLE RESIN COMPOSITION INCLUDING SILICONE POWDER | Showa Denko K.K. (JP) | 2008-07-02 | — | — | EP | disclosed |
| EP-1937737-A1 | CARBOXYL GROUP-CONTAINING POLYURETHANE AND HEAT-CURABLE POLYURETHANE RESIN COMPOSITION PREPARED THEREFROM | Showa Denko K.K. (JP) | 2008-07-02 | — | — | EP | disclosed |
| WO-2007108550-A1 | RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2007-09-27 | — | — | WO | disclosed |
| WO-2007105781-A1 | THERMOSETTING RESIN COMPOSITION AND USES THEREOF | SHOWA DENKO K.K. (JP) | 2007-09-20 | — | — | WO | disclosed |
| WO-2007066816-A1 | THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN COMPOSITION SOLUTION, FILM FORMING MATERIAL AND THEIR CURED PRODUCT | SHOWA DENKO K.K. (JP) | 2007-06-14 | — | — | WO | disclosed |
| WO-2007043544-A9 | CARBOXYL GROUP-CONTAINING POLYURETHANE AND HEAT-CURABLE POLYURETHANE RESIN COMPOSITION PREPARED THEREFROM | SHOWA DENKO KK (JP) | 2007-06-07 | — | — | WO | disclosed |
| WO-2007043544-A1 | CARBOXYL GROUP-CONTAINING POLYURETHANE AND HEAT-CURABLE POLYURETHANE RESIN COMPOSITION PREPARED THEREFROM | SHOWA DENKO K.K. (JP) | 2007-04-19 | — | — | WO | disclosed |
| WO-2007043536-A2 | HEAT-CURABLE RESIN COMPOSITION INCLUDING SILICONE POWDER | SHOWA DENKO K.K. (JP) | 2007-04-19 | — | — | WO | disclosed |