SCHEMBL4588448

SCHEMBL4588448

[Co].[Pd].[Pd]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL190955 1.00
Water SCHEMBL9722943 0.82
SCHEMBL9435531 0.82
SCHEMBL3652040 0.82
SCHEMBL920463 0.82
Phosphine SCHEMBL18259781 0.82
SCHEMBL17835305 0.82
SCHEMBL7622755 0.82
SCHEMBL7052652 0.82
SCHEMBL8436456 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7349223-B2 Enhanced compliant probe card systems having improved planarity NANONEXUS, INC. (US) 2008-03-25 US disclosed
EP-1549962-A4 CONSTRUCTION STRUCTURES AND MANUFACTURING PROCESSES FOR PROBE CARD ASSEMBLIES AND PACKAGES HAVING WAFER LEVEL SPRINGS NANONEXUS INC (US) 2005-12-14 EP disclosed
US-6917525-B2 Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs NANONEXUS, INC. (US) 2005-07-12 US disclosed
EP-1549962-A2 CONSTRUCTION STRUCTURES AND MANUFACTURING PROCESSES FOR PROBE CARD ASSEMBLIES AND PACKAGES HAVING WAFER LEVEL SPRINGS Nanonexus, Inc. (US) 2005-07-06 EP disclosed
US-20040223309-A1 Enhanced compliant probe card systems having improved planarity ADVANTEST (SINGAPORE) PTE LTD (SG) 2004-11-11 US disclosed
WO-2004001807-A2 CONSTRUCTION STRUCTURES AND MANUFACTURING PROCESSES FOR PROBE CARD ASSEMBLIES AND PACKAGES HAVING WAFER LEVEL SPRINGS NANONEXUS, INC. (US) 2003-12-31 WO disclosed
US-20030099097-A1 Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs ADVANTEST (SINGAPORE) PTE LTD (SG) 2003-05-29 US disclosed