Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.48 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.37 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.36 |
| ▸ | TSHR | P16473 | 2/20 | 0.32 |
| ▸ | LMNA | P02545 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Ethylene SCHEMBL16010245 | 1.00 | TDP1 (0.48) | TDP1MAPK1HSD17B10TSHRLMNA | |
| Ethylene SCHEMBL20494941 | 1.00 | TDP1 (0.48) | TDP1MAPK1HSD17B10TSHRLMNA | |
| Ethylene SCHEMBL9475186 | 1.00 | TDP1 (0.48) | TDP1MAPK1HSD17B10TSHRLMNA | |
| Ethylene SCHEMBL16178491 | 0.95 | TDP1 (0.50) | TDP1MAPK1HSD17B10 | |
| SCHEMBL23248659 | 0.95 | — | — | |
| SCHEMBL15111 | 0.95 | — | — | |
| SCHEMBL8747551 | 0.95 | — | — | |
| SCHEMBL16542024 | 0.95 | — | — | |
| SCHEMBL23248656 | 0.95 | — | — | |
| SCHEMBL7612087 | 0.95 | TDP1 (0.52) | TDP1MAPK1HSD17B10TSHRLMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20130200038-A1 | AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES FOR ELECTRICAL, MECHANICAL AND OPTICAL DEVICES | BASF SE (DE) | 2013-08-08 | — | — | US | claimed |
| EP-2614121-A1 | AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES FOR ELECTRICAL, MECHANICAL AND OPTICAL DEVICES | BASF SE (DE) | 2013-07-17 | — | — | EP | claimed |
| WO-2012032461-A1 | AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES FOR ELECTRICAL, MECHANICAL AND OPTICAL DEVICES | BASF SE (DE) | 2012-03-15 | — | — | WO | claimed |
| US-9891520-B2 | Use of surfactants having at least three short-chain perfluorinated groups in formulations for photo mask cleaning | BASF SE (DE) | 2018-02-13 | — | — | US | disclosed |
| US-9524874-B2 | Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon films | BASF SE (DE) | 2016-12-20 | — | — | US | disclosed |
| US-9496146-B2 | Method for forming through-base wafer vias | BASF SE (DE) | 2016-11-15 | — | — | US | disclosed |
| EP-3033408-A1 | THE USE OF SURFACTANTS HAVING AT LEAST THREE SHORT-CHAIN PERFLUORINATED GROUPS IN FORMULATIONS FOR PHOTO MASK CLEANING | BASF SE (DE) | 2016-06-22 | — | — | EP | disclosed |
| US-20160161846-A1 | THE USE OF SURFACTANTS HAVING AT LEAST THREE SHORT-CHAIN PERFLUORINATED GROUPS IN FORMULATIONS FOR PHOTO MASK CLEANING | BASF SE (DE) | 2016-06-09 | — | — | US | disclosed |
| US-9236256-B2 | Use of surfactants having at least three short-chain perfluorinated groups RF for manufacturing integrated circuits having patterns with line-space dimensions below 50 NM | BASF SE (DE) | 2016-01-12 | — | — | US | disclosed |
| WO-2015004596-A1 | THE USE OF SURFACTANTS HAVING AT LEAST THREE SHORT-CHAIN PERFLUORINATED GROUPS IN FORMULATIONS FOR PHOTO MASK CLEANING | BASF SE (DE) | 2015-01-15 | — | — | WO | disclosed |
| EP-2824511-A1 | The use of surfactants having at least three short-chain perfluorinated groups in formulations for photo mask cleaning | BASF SE (DE) | 2015-01-14 | — | — | EP | disclosed |
| US-20130248756-A1 | AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES CONTAINING SILICON OXIDE DIELECTRIC AND POLYSILICON FILMS | BASF SE (DE) | 2013-09-26 | — | — | US | disclosed |
| US-20130200038-A1 | AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES FOR ELECTRICAL, MECHANICAL AND OPTICAL DEVICES | BASF SE (DE) | 2013-08-08 | — | — | US | disclosed |
| EP-2614121-A1 | AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES FOR ELECTRICAL, MECHANICAL AND OPTICAL DEVICES | BASF SE (DE) | 2013-07-17 | — | — | EP | disclosed |
| WO-2012123839-A1 | METHOD FOR FORMING THROUGH-BASE WAFER VIAS | BASF SE (DE) | 2012-09-20 | — | — | WO | disclosed |
| WO-2012101545-A1 | USE OF SURFACTANTS HAVING AT LEAST THREE SHORT-CHAIN PERFLUORINATED GROUPS FOR MANUFACTURING INTEGRATED CIRCUITS HAVING PATTERNS WITH LINE-SPACE DIMENSIONS BELOW 50NM | BASF SE (DE) | 2012-08-02 | — | — | WO | disclosed |
| EP-2479616-A1 | The use of surfactants having at least three short-chain perfluorinated groups Rf for manufacturing integrated circuits having patterns with line-space dimensions below 50 nm | BASF SE (DE) | 2012-07-25 | — | — | EP | disclosed |
| WO-2012077063-A1 | AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES CONTAINING SILICON OXIDE DIELECTRIC AND POLYSILICON FILMS | BASF SE (DE) | 2012-06-14 | — | — | WO | disclosed |
| WO-2012032461-A1 | AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES FOR ELECTRICAL, MECHANICAL AND OPTICAL DEVICES | BASF SE (DE) | 2012-03-15 | — | — | WO | disclosed |
| CN-1114306-A | Non-toxic photosensitized active diluent with double functional groups | UNIV HUNAN (CN) | 1996-01-03 | — | — | CN | disclosed |