SCHEMBL4607767

SCHEMBL4607767

Fc1c(F)c(C(F)(F)F)c(F)c(F)c1[B-](c1c(F)c(F)c(C(F)(F)F)c(F)c1F)(c1c(F)c(F)c(C(F)(F)F)c(F)c1F)c1c(F)c(F)c(C(F)(F)F)c(F)c1F

nearest known ligand 0.34

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 2/20 0.34
TSHR P16473 1/20 0.34
MEN1 O00255 1/20 0.31
KMT2A Q03164 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Lithium Ion SCHEMBL20637799 0.97 TSHR (0.33) SMN1; SMN2TSHR
SCHEMBL9067341 0.97 TSHR (0.33) SMN1; SMN2TSHR
SCHEMBL21224959 0.88 TSHR (0.30) SMN1; SMN2TSHR
SCHEMBL26568311 0.88 MEN1 (0.30) SMN1; SMN2MEN1KMT2A
SCHEMBL7455035 0.81 TSHR (0.30) SMN1; SMN2TSHR
SCHEMBL312355 0.80 SMN1; SMN2 (0.42) SMN1; SMN2TSHRMEN1KMT2A
Pyridine SCHEMBL7453810 0.79
Perfluorotoluene SCHEMBL308464 0.77 SMN1; SMN2 (0.41) SMN1; SMN2TSHRMEN1KMT2A
SCHEMBL7453528 0.77 MEN1 (0.31) TSHRMEN1KMT2A
SCHEMBL7457967 0.77 SLC22A2 (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111094385-B Charge-transporting compound, composition containing charge-transporting compound, and organic electroluminescent element using same 三菱化学株式会社 2024-04-09 CN claimed
US-7378455-B2 A curable epoxy resin , two latent cationic curing catalyst, a free radical-producng cocatalyst and inorganic filler of about 70-95 weight % based on the total weight; catalyst allows the use of increased filler loadingsto reduce moisture absorption and thermal expansion; encapsulating solid state device GENERAL ELECTRIC COMPANY (US) 2008-05-27 US claimed
US-20070004819-A1 A curable epoxy resin , two latent cationic curing catalyst, a free radical-producng cocatalyst and inorganic filler of about 70-95 weight % based on the total weight; catalyst allows the use of increased filler loadingsto reduce moisture absorption and thermal expansion; encapsulating solid state device CITIBANK, N.A., AS COLLATERAL AGENT 2007-01-04 US claimed
CN-111094385-B Charge-transporting compound, composition containing charge-transporting compound, and organic electroluminescent element using same 三菱化学株式会社 2024-04-09 CN disclosed
CN-111094385-A Charge-transporting compound, composition containing charge-transporting compound, and organic electroluminescent element using same 三菱化学株式会社 2020-05-01 CN disclosed
EP-1943287-A2 MOLDING COMPOSITION AND METHOD, AND MOLDED ARTICLE General Electric Company (US) 2008-07-16 EP disclosed
US-7378455-B2 A curable epoxy resin , two latent cationic curing catalyst, a free radical-producng cocatalyst and inorganic filler of about 70-95 weight % based on the total weight; catalyst allows the use of increased filler loadingsto reduce moisture absorption and thermal expansion; encapsulating solid state device GENERAL ELECTRIC COMPANY (US) 2008-05-27 US disclosed
WO-2007005280-A2 MOLDING COMPOSITION AND METHOD, AND MOLDED ARTICLE GENERAL ELECTRIC COMPANY (US) 2007-01-11 WO disclosed
US-20070004819-A1 A curable epoxy resin , two latent cationic curing catalyst, a free radical-producng cocatalyst and inorganic filler of about 70-95 weight % based on the total weight; catalyst allows the use of increased filler loadingsto reduce moisture absorption and thermal expansion; encapsulating solid state device CITIBANK, N.A., AS COLLATERAL AGENT 2007-01-04 US disclosed