⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7691478 | 0.97 | — | — | |
| SCHEMBL7699538 | 0.89 | — | — | |
| SCHEMBL7697866 | 0.87 | — | — | |
| SCHEMBL7693176 | 0.83 | — | — | |
| SCHEMBL16603033 | 0.78 | — | — | |
| SCHEMBL7693178 | 0.75 | — | — | |
| SCHEMBL31601299 | 0.74 | — | — | |
| SCHEMBL16181725 | 0.73 | — | — | |
| SCHEMBL373132 | 0.67 | — | — | |
| SCHEMBL302202 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1889862-A1 | Curable resin composition, process for producing the same, and coated object made with the same | DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) | 2008-02-20 | — | — | EP | disclosed |
| EP-1172393-B1 | CURABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND COATED OBJECT MADE WITH THE SAME | DAICEL CHEM (JP) | 2007-10-31 | — | — | EP | disclosed |
| US-6924008-B2 | Curable resin composition, a method for the preparation thereof, and a coated article thereof | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2005-08-02 | — | — | US | disclosed |
| US-20030032729-A1 | Curable resin composition, process for producing the same, and coated object made with the same | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2003-02-13 | — | — | US | disclosed |
| US-6437090-B1 | ORGANOMETALLIC COMPOUND CAPABLE OF REVERSIBLY DISSOLVING AND PRECIPITATING THROUGH HEATING AND COOLING; ORGANOSILICON COMPOUND; ONE LIGAND CONTAINS AN ALKYL GROUP HAVING 10 OR MORE CARBON ATOMS; EPOXY RESIN; STORAGE STABLE; ONLY CURES ON HEAT | KABUSHIKI KAISHA TOSHIBA (JP) | 2002-08-20 | — | — | US | disclosed |
| US-6344579-B1 | REACTION OF FLUOROSILICON COMPOUND WITH REACTION OF SILICON WITH HYDROXY, ALKOXY OR ARYLOXY GROUP WITH DIFLUORODIAMINO COMPOUND | MITSUI CHEMICALS, INC. (JP) | 2002-02-05 | — | — | US | disclosed |
| EP-1172393-A1 | CURABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND COATED OBJECT MADE WITH THE SAME | DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) | 2002-01-16 | — | — | EP | disclosed |
| EP-1138633-A1 | PROCESS FOR PRODUCING FLUORINATED SILICON COMPOUND | Mitsui Chemicals, Inc. (JP) | 2001-10-04 | — | — | EP | disclosed |
| US-6096836-A | OXYGEN CONTAINING AROMATIC CATALYST AND ALUMINUM COMPOUND | KABUSHIKI KAISHA TOSHIBA (JP) | 2000-08-01 | — | — | US | disclosed |
| US-5811497-A | STORAGE STABLE EPOXY RESINS ACTIVATE THE CURING WHEN APPLYING THE HEAT; FLEXIBILITY, DIELECTRIC, MECHANICAL STRENGTH | KABUSHIKI KAISHA TOSHIBA (JP) | 1998-09-22 | — | — | US | disclosed |