SCHEMBL461894

SCHEMBL461894

CC(C)(c1ccc(O)cc1)c1ccc(-c2ccc(C(C)(c3ccc(O)cc3)c3ccc(O)cc3)cc2)cc1

nearest known ligand 0.73

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 8/20 0.73
ESR2 Q92731 8/20 0.73
CYP3A4 P08684 2/20 0.73
AR P10275 1/20 0.73
HPGD P15428 1/20 0.73
TSHR P16473 1/20 0.73
SLC6A2 P23975 1/20 0.73
SLC6A4 P31645 1/20 0.73
HTR6 P50406 1/20 0.73
ESRRG P62508 1/20 0.73
SLC6A3 Q01959 1/20 0.73
HSD17B10 Q99714 1/20 0.73
ALDH1A1 P00352 1/20 0.61
LMNA P02545 1/20 0.52
TYR P14679 1/20 0.52
KIF11 P52732 1/20 0.52
MEN1 O00255 1/20 0.50
KMT2A Q03164 1/20 0.50
SHBG P04278 1/20 0.43
MMP3 P08254 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26136547 0.93 ESR1 (0.70) ESR1ESR2CYP3A4ARHPGD
SCHEMBL35973 0.93 ESR1 (0.84) ESR1ESR2CYP3A4ARHPGD
SCHEMBL10772499 0.93 ESR1 (0.70) ESR1ESR2CYP3A4ARHPGD
SCHEMBL3149692 0.93 ESR1 (0.84) ESR1ESR2CYP3A4ARHPGD
SCHEMBL12004872 0.93 ESR1 (0.70) ESR1ESR2CYP3A4ARHPGD
Bisphenol A SCHEMBL5141906 0.93 ESR1 (0.84) ESR1ESR2CYP3A4ARHPGD
SCHEMBL6277528 0.93 ESR1 (0.84) ESR1ESR2CYP3A4ARHPGD
SCHEMBL9785062 0.93 ESR1 (0.84) ESR1ESR2CYP3A4ARHPGD
SCHEMBL14433370 0.90 ESR1 (0.59) ESR1ESR2CYP3A4ARHPGD
SCHEMBL3681031 0.86 ESR1 (0.73) ESR1ESR2CYP3A4ARHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 149 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024090157-A1 POLYCARBONATE RESIN AND MOLDED ARTICLE FORMED OF SAME 帝人株式会社 2024-05-02 WO disclosed
US-20240117184-A1 POLYCARBONATE RESIN COMPOSITION AND MOLDED ARTICLE TEIJIN LIMITED (JP) 2024-04-11 US disclosed
WO-2024075642-A1 POLYCARBONATE COPOLYMER AND MOLDED ARTICLE COMPRISING SAME 帝人株式会社 2024-04-11 WO disclosed
WO-2024053274-A1 POLYCARBONATE RESIN COMPOSITION AND MOLDED ARTICLE FORMED OF SAME 帝人株式会社 2024-03-14 WO disclosed
WO-2023243350-A1 POLYCARBONATE RESIN COMPOSITION AND MOLDED ARTICLE COMPRISING SAME 帝人株式会社 2023-12-21 WO disclosed
WO-2023228768-A1 THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE FORMED FROM SAME 帝人株式会社 2023-11-30 WO disclosed
EP-3858919-B1 FLAME-RETARDANT POLYCARBONATE RESIN COMPOSITION TEIJIN LTD (JP) 2023-10-25 EP disclosed
US-11773258-B2 Flame-retardant polycarbonate resin composition TEIJIN LIMITED (JP) 2023-10-03 US disclosed
US-11760840-B2 Thermoplastic resin composition and molded article thereof TEIJIN LIMITED (JP) 2023-09-19 US disclosed
US-20230265282-A1 POLYCARBONATE RESIN COMPOSITION AND MOLDED ARTICLE HAVING DOT-LIKE APPEARANCE TEIJIN LIMITED (JP) 2023-08-24 US disclosed
EP-1300445-A1 AROMATIC POLYCARBONATE RESIN COMPOSITION Teijin Chemicals, Ltd. (JP) 2003-04-09 EP disclosed
US-20030065092-A1 Reclaimed resin composition TEIJIN CHEMICALS, LTD. (JP) 2003-04-03 US disclosed
EP-1288262-A2 Flame retardant aromatic polycarbonate resin composition and molded articles thereof Teijin Chemicals, Ltd. (JP) 2003-03-05 EP disclosed
US-6503974-B1 Dimensional stability, lightweight, rigidity, heat resistance molding materials TEIJIN CHEMICALS, LTD. (JP) 2003-01-07 US disclosed
US-20030004251-A1 Aromatic polycarbonate resin composition TEIJIN CHEMICALS LTD. (JP) 2003-01-02 US disclosed
US-20030004256-A1 Vibration- damping thermoplastic resin composition and molded article therefrom TEIJIN CHEMICALS LTD. (JP) 2003-01-02 US disclosed
EP-1236758-A1 COLORED MASTER PELLET FOR OPTICAL MOLDINGS AND COLORED OPTICAL DISK SUBSTRATE Teijin Chemicals, Ltd. (JP) 2002-09-04 EP disclosed
EP-1191065-A1 RECLAIMED RESIN COMPOSITION Teijin Chemicals, Ltd. (JP) 2002-03-27 EP disclosed
EP-1158024-A1 DAMPING THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLES Teijin Chemicals, Ltd. (JP) 2001-11-28 EP disclosed
US-20010044004-A1 Optical recording medium SONY CORPORATION (JP) 2001-11-22 US disclosed