⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL157416 | 0.82 | — | — | |
| SCHEMBL2590811 | 0.82 | — | — | |
| SCHEMBL3904999 | 0.82 | — | — | |
| SCHEMBL295701 | 0.82 | — | — | |
| SCHEMBL18488861 | 0.67 | — | — | |
| Water SCHEMBL8926378 | 0.67 | — | — | |
| SCHEMBL1658208 | 0.67 | — | — | |
| SCHEMBL10937772 | 0.67 | — | — | |
| SCHEMBL6694153 | 0.67 | — | — | |
| Water SCHEMBL7915305 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1383162-B1 | Deposition method of dielectric layer | SAMSUNG ELECTRONICS CO LTD (KR) | 2008-01-02 | — | — | EP | claimed |
| CN-100356518-C | Deposition method for dielectric layer | SAMSUNG ELECTRONICS CO LTD (KR) | 2007-12-19 | — | — | CN | claimed |
| US-6911402-B2 | Deposition method of a dielectric layer | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2005-06-28 | — | — | US | claimed |
| US-20040018747-A1 | Deposition method of a dielectric layer | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2004-01-29 | — | — | US | claimed |
| EP-1383162-A2 | Deposition method of dielectric layer | Samsung Electronics Co., Ltd. (KR) | 2004-01-21 | — | — | EP | claimed |
| CN-1469439-A | Deposition method for dielectric layer | ���ǵ�����ʽ���� | 2004-01-21 | — | — | CN | claimed |
| US-20190036017-A1 | MAGNETIC SWITCHING MATERIALS AND PREPARATION THEREOF | BOARD OF SUPERVISORS OF LOUISIANA STATE UNIVERSITY AND AGRICULTURAL AND MECHANICAL COLLEGE (US) | 2019-01-31 | — | — | US | disclosed |
| EP-1383162-B1 | Deposition method of dielectric layer | SAMSUNG ELECTRONICS CO LTD (KR) | 2008-01-02 | — | — | EP | disclosed |
| CN-100356518-C | Deposition method for dielectric layer | SAMSUNG ELECTRONICS CO LTD (KR) | 2007-12-19 | — | — | CN | disclosed |
| US-6911402-B2 | Deposition method of a dielectric layer | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2005-06-28 | — | — | US | disclosed |
| US-20040018747-A1 | Deposition method of a dielectric layer | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2004-01-29 | — | — | US | disclosed |
| EP-1383162-A2 | Deposition method of dielectric layer | Samsung Electronics Co., Ltd. (KR) | 2004-01-21 | — | — | EP | disclosed |
| CN-1469439-A | Deposition method for dielectric layer | ���ǵ�����ʽ���� | 2004-01-21 | — | — | CN | disclosed |