SCHEMBL465797

SCHEMBL465797

CCC[CH]N=C=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3692562 0.82
SCHEMBL4110726 0.80 TSHR (0.46)
SCHEMBL4091771 0.80 TSHR (0.46)
SCHEMBL4099134 0.80 TSHR (0.46)
SCHEMBL3699923 0.80 TSHR (0.46)
SCHEMBL4107153 0.80 TSHR (0.46)
SCHEMBL3698478 0.80 TSHR (0.46)
SCHEMBL4110932 0.80 TSHR (0.46)
SCHEMBL4099541 0.80 TSHR (0.46)
SCHEMBL4103453 0.80 TSHR (0.46)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107641484-B Binder, method of preparing the same, and electrode and lithium battery including the same 三星电子株式会社 2021-09-24 CN claimed
EP-3480224-B1 ELECTRO-OPTIC POLYMER NAT INST INF & COMM TECH (JP) 2024-06-12 EP disclosed
CN-109415468-B Electro-optical polymers 国立研究开发法人情报通信研究机构 2024-06-07 CN disclosed
EP-4349931-A1 PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE TAPE Nitto Denko Corporation (JP) 2024-04-10 EP disclosed
EP-4317222-A1 (METH)ACRYLIC ACID ESTER-BASED COPOLYMER AND CURABLE COMPOSITION Kaneka Corporation (JP) 2024-02-07 EP disclosed
EP-4317207-A1 CURABLE COMPOSITION AND CURED PRODUCT THEREOF Kaneka Corporation (JP) 2024-02-07 EP disclosed
US-20240018287-A1 (METH)ACRYLIC ESTER COPOLYMER AND CURABLE COMPOSITION KANEKA CORPORATION (JP) 2024-01-18 US disclosed
EP-3748420-B1 ELECTRO-OPTICAL POLYMER NAT INST INF & COMM TECH (JP) 2024-01-17 EP disclosed
WO-2023248726-A1 ADHESIVE COMPOSITION, ADHESIVE SHEET, MULTILAYER BODY, AND METHOD FOR PRODUCING β-1,3-GLUCAN DERIVATIVE 日東電工株式会社 2023-12-28 WO disclosed
WO-2023248911-A1 PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE SHEET, LAMINATE, AND METHOD FOR PRODUCING β-1,3-GLUCAN DERIVATIVE 日東電工株式会社 2023-12-28 WO disclosed
US-20090214768-A1 PROCESS FOR PRODUCING MAGNETIC RECORDING MEDIUM FUJIFILM CORPORATION (JP) 2009-08-27 US disclosed
US-20060148995-A1 Method for producing a modified propylene polymer SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2006-07-06 US disclosed
US-20040049000-A1 Aqueous coating composition KANSAI PAINT CO., LTD. (JP) 2004-03-11 US disclosed
EP-1331256-A1 AQUEOUS COATING COMPOSITION KANSAI PAINT CO., LTD. (JP) 2003-07-30 EP disclosed
US-5393823-A One-can paint, stable for one month, comprising an acrylic copolymer having pendant moisture-hydrolizable siloxy groups and a curing agent; plastic substrates DAINIPPON INK AND CHEMICALS, INC. (JP) 1995-02-28 US disclosed
EP-0373952-B1 Photosensitive resin composition and photosensitive element using the same HITACHI CHEMICAL CO LTD (JP) 1995-02-08 EP disclosed
US-5262277-A Light sensitive elements for electrical thick films with heat resistance HITACHI CHEMICAL COMPANY, INC. (JP) 1993-11-16 US disclosed
EP-0231932-B1 COATING RESIN COMPOSITION DAINIPPON INK AND CHEMICALS, INC. (JP) 1992-01-29 EP disclosed
EP-0373952-A2 Photosensitive resin composition and photosensitive element using the same Hitachi Chemical Co., Ltd. (JP) 1990-06-20 EP disclosed
EP-0231932-A2 Coating resin composition DAINIPPON INK AND CHEMICALS, INC. (JP) 1987-08-12 EP disclosed