Ethylene

Ethylene

SCHEMBL465945

C=C.C=O.N.N

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ethylene SCHEMBL5553251 0.89
Formaldehyde SCHEMBL15995003 0.89
Formaldehyde SCHEMBL2590690 0.89
Formaldehyde SCHEMBL3341363 0.89
Formaldehyde SCHEMBL918419 0.89
Formaldehyde SCHEMBL23711596 0.80
Formaldehyde SCHEMBL14127337 0.80
Formaldehyde SCHEMBL14127087 0.80
Formaldehyde SCHEMBL11714074 0.80
Formaldehyde SCHEMBL9666368 0.80

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 71 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6268422-B1 POLYVINYL ALCOHOL STABILIZED BUTADIENE POLYMER LATEX FORMED BY EMULSION POLYMERIZATION AND METHYLENE DONORS LORD CORPORATION 2001-07-31 US claimed
EP-0728149-B1 AQUEOUS ADHESIVE FOR BONDING ELASTOMERS LORD CORP (US) 1999-05-26 EP claimed
EP-0476902-B1 Phenolic resin adhesion promoters and adhesive compositions LORD CORP (US) 1996-11-13 EP claimed
EP-0728149-A4 1996-09-11 EP claimed
EP-0728149-A1 AQUEOUS ADHESIVE FOR BONDING ELASTOMERS LORD CORPORATION (US) 1996-08-28 EP claimed
WO-1995013304-A1 AQUEOUS ADHESIVE FOR BONDING ELASTOMERS LORD CORPORATION (US) 1995-05-18 WO claimed
US-5162156-A PHENOLIC RESIN ADHESION PROMOTERS AND ADHESIVE COMPOSITIONS, AND BONDING METHOD EMPLOYING SAME LORD CORPORATION (US) 1992-11-10 US claimed
EP-0476902-A2 Phenolic resin adhesion promoters and adhesive compositions LORD CORPORATION (US) 1992-03-25 EP claimed
US-11584858-B2 Dry powder thermosetting resin composition H.B. FULLER COMPANY (US) 2023-02-21 US disclosed
EP-3918008-B1 DRY POWDER THERMOSETTING RESIN COMPOSITION FULLER H B CO (US) 2023-01-04 EP disclosed
EP-3918008-A1 DRY POWDER THERMOSETTING RESIN COMPOSITION H.B. Fuller Company (US) 2021-12-08 EP disclosed
US-20200248004-A1 DRY POWDER THERMOSETTING RESIN COMPOSITION JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT 2020-08-06 US disclosed
WO-2020160381-A1 DRY POWDER THERMOSETTING RESIN COMPOSITION H.B. FULLER COMPANY (US) 2020-08-06 WO disclosed
EP-2344600-B1 POWDERED PRIMER FOR RUBBER TO METAL BONDING LORD CORP (US) 2014-04-30 EP disclosed
WO-1993015160-A1 AQUEOUS ADHESIVE COMPOSITIONS CONTAINING STABILIZED PHENOLIC RESINS LORD CORPORATION (US) 1993-08-05 WO disclosed
US-5200455-A Polyvinyl alcohol stabilizer, chlorosulfonated polyethylene and metal oxide LORD CORPORATION (US) 1993-04-06 US disclosed
US-5162156-A PHENOLIC RESIN ADHESION PROMOTERS AND ADHESIVE COMPOSITIONS, AND BONDING METHOD EMPLOYING SAME LORD CORPORATION (US) 1992-11-10 US disclosed
EP-0476902-A2 Phenolic resin adhesion promoters and adhesive compositions LORD CORPORATION (US) 1992-03-25 EP disclosed
US-4661120-A WAX CRYSTAL MODIFIER, SLUDGE DISPERSANT AND STABILIZER, HYDROCARBON SOLVENT, WATER SOLVENT CONTAINING ETHYLENE OXY UNITS; FOR COLD WEATHER NALCO CHEMICAL COMPANY (US) 1987-04-28 US disclosed
US-4167500-A ACETAL RESINS LORD CORPORATION (US) 1979-09-11 US disclosed