SCHEMBL466215

SCHEMBL466215

COC(=O)C1(CC2CC3OC3CC2C)CCC2OC2C1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1302441 0.85 PPP5C (0.30)
SCHEMBL31193315 0.82 PPM1B (0.32)
SCHEMBL28549761 0.80
SCHEMBL8997401 0.73
SCHEMBL11655327 0.73 CYP4F2 (0.31)
SCHEMBL11723429 0.72
SCHEMBL27899398 0.72
SCHEMBL1010976 0.72
SCHEMBL28126083 0.71 CYP4F2 (0.44)
SCHEMBL187543 0.69 PPP5C (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113956441-B Molded free radical modified epoxy resin composition 上纬新材料科技股份有限公司 2023-12-26 CN disclosed
CN-113150496-B Epoxy resin reinforced material 上纬新材料科技股份有限公司 2023-09-05 CN disclosed
CN-113150221-B Unsaturated polyester and free radical modified epoxy resin composition 上纬新材料科技股份有限公司 2023-05-16 CN disclosed
EP-2406318-A2 RADIATION CURABLE RESIN COMPOSITION AND RAPID THREE-DIMENSIONAL IMAGING PROCESS USING THE SAME DSM IP Assets B.V. (NL) 2012-01-18 EP disclosed
WO-2010104603-A2 RADIATION CURABLE RESIN COMPOSITION AND RAPID THREE-DIMENSIONAL IMAGING PROCESS USING THE SAME DSM IP ASSETS B.V (NL) 2010-09-16 WO disclosed