SCHEMBL4666530

SCHEMBL4666530

C=CC=CC.C=CCCC

nearest known ligand 0.63

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.63
ALDH1A1 P00352 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4666528 1.00 TSHR (0.63) TSHRALDH1A1
SCHEMBL8098157 0.84 TSHR (0.44) TSHRALDH1A1
SCHEMBL9721007 0.83
SCHEMBL9721011 0.83
SCHEMBL4435959 0.81 TSHR (0.70) TSHRALDH1A1
Butadiene SCHEMBL11855630 0.80
Propene SCHEMBL935568 0.80
Propane SCHEMBL27390594 0.80
SCHEMBL7040 0.80
SCHEMBL8468547 0.80 TSHR (1.00) TSHRALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117836342-A Resin composition, and curable film and laminate comprising same 三菱瓦斯化学株式会社 2024-04-05 CN disclosed
WO-2023176763-A1 RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL-FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE 三菱瓦斯化学株式会社 2023-09-21 WO disclosed
WO-2023176766-A1 RESIN, RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE 三菱瓦斯化学株式会社 2023-09-21 WO disclosed
WO-2023176764-A1 RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE 三菱瓦斯化学株式会社 2023-09-21 WO disclosed
WO-2023176765-A1 HYDROXY RESIN, STYRENE RESIN, METHOD FOR PRODUCING HYDROXY RESIN, METHOD FOR PRODUCING STYRENE RESIN, AND APPLICATIONS THEREOF 三菱瓦斯化学株式会社 2023-09-21 WO disclosed
EP-1876501-A2 Volume hologram laminate and label for preparation of volume hologram laminate Dai Nippon Printing Co., Ltd. (JP) 2008-01-09 EP disclosed
EP-1876500-A2 Volume hologram laminate and label for preparation of volume hologram laminate Dai Nippon Printing Co., Ltd. (JP) 2008-01-09 EP disclosed
EP-0949547-B1 Volume hologram laminate and label for preparation of volume hologram laminate DAINIPPON PRINTING CO LTD (JP) 2008-01-09 EP disclosed
US-6756157-B2 CONTROLLING REPRODUCTION WAVELENGTHS; MULTILAYER CONTAINING ADHESIVE LAYERS DAI NIPPON PRINTING CO., LTD. (JP) 2004-06-29 US disclosed
US-20020015896-A1 VOLUME HOLOGRAM LAMINATE AND LABEL FOR PREPARATION OF VOLUME HOLOGRAM LAMINATE DAI NIPPON PRINTING CO., LTD. (JP) 2002-02-07 US disclosed
EP-0949547-A2 Volume hologram laminate and label for preparation of volume hologram laminate DAI NIPPON PRINTING CO., LTD. (JP) 1999-10-13 EP disclosed
US-4590319-A USING AS CATALYST A COBALT COMPOUND, ORGANOPHOSPHINE COMPOUND, AND ALUMINUM COMPOUND MITSUBISHI CHEMICAL INDUSTRIES, LTD. (JP) 1986-05-20 US disclosed