SCHEMBL467469

SCHEMBL467469

[CH2]C(O)CCC#N

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10486651 0.83
SCHEMBL29154617 0.75 TSHR (0.46)
SCHEMBL1291214 0.75
SCHEMBL10338669 0.74 TSHR (0.40)
Ammonia Solution, Strong SCHEMBL6542834 0.73
SCHEMBL6860794 0.72
SCHEMBL10904067 0.71
SCHEMBL6032148 0.71
SCHEMBL7396397 0.71
SCHEMBL3613683 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 284 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118055992-A Adhesive for high-frequency dielectric heating 琳得科株式会社 2024-05-17 CN claimed
WO-2024101900-A1 SEPARATOR FOR SECONDARY BATTERY AND METHOD FOR MANUFACTURING SAME 주식회사 엘지화학 2024-05-16 WO claimed
WO-2023054114-A1 HIGH-FREQUENCY DIELECTRIC HEATING ADHESIVE リンテック株式会社 2023-04-06 WO claimed
EP-3001439-B1 SEMICONDUCTOR FILM AND APPLICATION LIQUID FOR ITS FABRICATION ASAHI CHEMICAL IND (JP) 2021-11-03 EP claimed
US-10944018-B2 Semiconductor film and semiconductor element ASAHI KASEI KABUSHIKI KAISHA (JP) 2021-03-09 US claimed
US-10879536-B2 Cathode and lithium battery including cathode SAMSUNG ELECTRONICS CO., LTD. (KR) 2020-12-29 US claimed
EP-2654094-B1 POLYMER COMPOSITE PIEZOELECTRIC BODY AND METHOD FOR PRODUCING SAME FUJIFILM CORP (JP) 2020-07-29 EP claimed
US-20190260031-A1 CATHODE AND LITHIUM BATTERY INCLUDING CATHODE SAMSUNG ELECTRONICS CO., LTD. (KR) 2019-08-22 US claimed
CN-106905436-A The synthesis preparation method of cyanoethyl hydroxyethyl cellulose 深圳市佩成科技有限责任公司 2017-06-30 CN claimed
US-8771541-B2 Polymer composite piezoelectric body and manufacturing method for the same FUJIFILM CORPORATION (JP) 2014-07-08 US claimed
EP-2305743-A1 Dielectric film, associated article and method General Electric Company (US) 2011-04-06 EP claimed
US-20110075320-A1 Dielectric Film, Associated Article and Method GENERAL ELECTRIC COMPANY (US) 2011-03-31 US claimed
US-20100302707-A1 COMPOSITE STRUCTURES FOR HIGH ENERGY-DENSITY CAPACITORS AND OTHER DEVICES GENERAL ELECTRIC COMPANY (US) 2010-12-02 US claimed
EP-2255961-A1 Composite structures for high energy-density capacitors and other device General Electric Company (US) 2010-12-01 EP claimed
US-7542265-B2 High energy density capacitors and methods of manufacture GENERAL ELECTRIC COMPANY (US) 2009-06-02 US claimed
US-20090101873-A1 ELECTROMAGNETIC INTERFERENCE SHIELDING POLYMER COMPOSITES AND METHODS OF MANUFACTURE GENERAL ELECTRIC COMPANY (US) 2009-04-23 US claimed
US-20080123250-A1 High energy density capacitors and methods of manufacture GENERAL ELECTRIC COMPANY 2008-05-29 US claimed
US-5636100-A Capacitor having an enhanced dielectric breakdown strength THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE ARMY (US) 1997-06-03 US claimed
US-5490035-A HIGH DIELECTRIC THE UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF THE NATIONAL AERONAUTICS AND SPACE ADMINISTRATION (US) 1996-02-06 US claimed
EP-0088050-A2 Coloured photo-hardenable composition CIBA-GEIGY AG (CH) 1983-09-07 EP claimed