SCHEMBL467705

SCHEMBL467705

CO[SiH](OC)C(Cl)Cl

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28962091 0.62
SCHEMBL19900524 0.61
SCHEMBL30168809 0.61
SCHEMBL2110289 0.61
SCHEMBL29240612 0.61
SCHEMBL28736777 0.61
SCHEMBL8852226 0.59
SCHEMBL5410416 0.59
SCHEMBL14889148 0.59
SCHEMBL5419933 0.59

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 69 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115724439-B Halogen-containing titanium-silicon molecular sieve and preparation method thereof 中国石油化工股份有限公司 2024-06-11 CN claimed
CN-115724439-A Titanium-silicon molecular sieve containing halogen and preparation method thereof 中国石油化工股份有限公司 2023-03-03 CN claimed
CN-115724766-B Ammonia oximation method 中国石油化工股份有限公司 2024-11-12 CN disclosed
CN-115724439-B Halogen-containing titanium-silicon molecular sieve and preparation method thereof 中国石油化工股份有限公司 2024-06-11 CN disclosed
CN-115724719-B Method for preparing halohydrin 中国石油化工股份有限公司 2024-05-28 CN disclosed
CN-115724808-B Olefin epoxidation method 中国石油化工股份有限公司 2024-05-17 CN disclosed
WO-2024009957-A1 LIGHT/MOISTURE CURABLE RESIN COMPOSITION, CURED PRODUCT, USE OF LIGHT/MOISTURE CURABLE RESIN COMPOSITION, AND END FACE PROTECTION METHOD 積水化学工業株式会社 2024-01-11 WO disclosed
CN-116803966-A Method for preparing vicinal diol by titanium-silicon molecular sieve catalysis 中国石油化工股份有限公司 2023-09-26 CN disclosed
WO-2023176795-A1 LIGHT-MOISTURE CURABLE RESIN COMPOSITION, ADHESIVE AGENT FOR ELECTRONIC COMPONENT, AND ADHESIVE AGENT FOR DISPLAY ELEMENT 積水化学工業株式会社 2023-09-21 WO disclosed
WO-2023153514-A1 PHOTO/MOISTURE-CURABLE RESIN COMPOSITION, ADHESIVE FOR ELECTRONIC COMPONENT, AND ADHESIVE FOR DISPLAY ELEMENT 積水化学工業株式会社 2023-08-17 WO disclosed
CN-115724719-A Method for preparing halohydrin 中国石油化工股份有限公司 2023-03-03 CN disclosed
US-20090247712-A1 CURABLE ORGANIC POLYMER AND METHOD FOR PRODUCTION THEREOF, AND CURABLE COMPOSITION CONTAINING THE SAME KANEKA CORPORATION (JP) 2009-10-01 US disclosed
EP-2080777-A1 HARDENING ORGANIC POLYMER, PROCESS FOR PRODUCING THE SAME, AND HARDENING COMPOSITION CONTAINING THE POLYMER Kaneka Corporation (JP) 2009-07-22 EP disclosed
CN-100457451-C Gas barrier laminate and packaged article, and method for producing gas barrier laminate KURARAY CO (JP) 2009-02-04 CN disclosed
CN-101189125-A Gas barrier laminate, method for producing same, and package using same KURARAY CO LTD KURASHIKI PLANT (JP) 2008-05-28 CN disclosed
CN-101184672-A Paper container KURARAY CO (JP) 2008-05-21 CN disclosed
EP-1870342-A1 PAPER CONTAINER KURARAY CO., LTD. (JP) 2007-12-26 EP disclosed
US-20070111005-A1 Gas barrier laminate and packaged article, and method for producing gas barrier laminate KURARAY CO., LTD. (JP) 2007-05-17 US disclosed
CN-1890093-A Gas barrier laminate and packaged article, and method for producing gas barrier laminate KURARAY CO (JP) 2007-01-03 CN disclosed
EP-1690678-A1 GAS BARRIER LAMINATE AND PACKAGED ARTICLE, AND METHOD FOR PRODUCING GAS BARRIER LAMINATE KURARAY CO., LTD. (JP) 2006-08-16 EP disclosed