SCHEMBL467737

SCHEMBL467737

CC(C)O[Si](C)OC(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2100351 0.75
SCHEMBL124149 0.70
SCHEMBL28156934 0.64
SCHEMBL28331311 0.62
SCHEMBL7055399 0.60
SCHEMBL875545 0.58
SCHEMBL3519925 0.52
SCHEMBL1446120 0.52
SCHEMBL28095 0.51
SCHEMBL1296 0.51

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 430 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240228774-A9 CURABLE COMPOSITION, CURED PRODUCT, ADHESIVE, AND SEALING MATERIAL AGC Inc. (JP) 2024-07-11 US disclosed
US-20240228817-A9 CURABLE COMPOSITION, CURED PRODUCT, COATING AGENT, AND CONCRETE STRUCTURE KANEKA CORPORATION (JP) 2024-07-11 US disclosed
EP-3808792-B1 AQUEOUS EMULSION OF POLYETHER HAVING AT LEAST ONE REACTIVE SILYL GROUP KANEKA BELGIUM NV (BE) 2024-07-03 EP disclosed
WO-2024135214-A1 EMULSION COMPOSITION AND PRODUCTION METHOD THEREFOR 株式会社カネカ 2024-06-27 WO disclosed
EP-3577155-B1 A MOISTURE-CURABLE ADHESIVE COMPOSITION AND A METHOD FOR MOUNTING TILES ON WALL SURFACES BOSTIK INC (US) 2024-06-26 EP disclosed
EP-4368671-A1 CURABLE COMPOSITION, CURED PRODUCT, ADHESIVE, AND SEALING MATERIAL AGC INC. (JP) 2024-05-15 EP disclosed
EP-4368670-A1 CURABLE COMPOSITION, CURED PRODUCT, COATING AGENT, AND CONCRETE STRUCTURE Kaneka Corporation (JP) 2024-05-15 EP disclosed
US-20240132743-A1 CURABLE COMPOSITION, CURED PRODUCT, COATING AGENT, AND CONCRETE STRUCTURE KANEKA CORPORATION (JP) 2024-04-25 US disclosed
US-20240132718-A1 CURABLE COMPOSITION, CURED PRODUCT, ADHESIVE, AND SEALING MATERIAL AGC Inc. (JP) 2024-04-25 US disclosed
EP-4353755-A1 CURABLE COMPOSITION AND CURED PRODUCT Soken Chemical & Engineering Co., Ltd. (JP) 2024-04-17 EP disclosed
US-20040214950-A1 Curable composition KANEKA CORPORATION (JP) 2004-10-28 US disclosed
EP-1471113-A1 Curable composition Kaneka Corporation (JP) 2004-10-27 EP disclosed
US-20040198885-A1 Curable composition KANEKA CORPORATION (JP) 2004-10-07 US disclosed
EP-1445287-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2004-08-11 EP disclosed
US-20040127631-A1 Curable composition KANEKA CORPORATION (JP) 2004-07-01 US disclosed
EP-1090960-B1 TWO-PACK TYPE CURABLE COMPOSITION AND HARDENER THEREFOR KANEKA CORP (JP) 2004-06-02 EP disclosed
US-6703442-B1 CURING AGENT COMPOSITION FOR TWO-PACK TYPE CURABLE COMPOSITION USE, WHICH COMPRISES HYDROLYZABLE SILYL GROUP-CONTAINING COMPOUND INCLUDING AMINOALKYL GROUP, NON-PHTHALIC ACID ESTER BASED PLASTICIZER, AND BIVALENT TIN BASED CURING CATALYST KANEKA CORPORATION (JP) 2004-03-09 US disclosed
EP-1391484-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2004-02-25 EP disclosed
US-20030220448-A1 Flame retardant silicone compositions SHIN-ETSU CHEMICAL CO., LTD. (JP) 2003-11-27 US disclosed
EP-1090960-A1 TWO-PACK TYPE CURABLE COMPOSITION AND HARDENER THEREFOR Kaneka Corporation (JP) 2001-04-11 EP disclosed