SCHEMBL467807

SCHEMBL467807

C=CC(S)SSC(S)C=C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1135991 0.65 — —
SCHEMBL6450766 0.61 — —
SCHEMBL8522417 0.58 — —
SCHEMBL252880 0.58 — —
SCHEMBL175774 0.58 — —
SCHEMBL5613556 0.58 — —
SCHEMBL132351 0.58 — —
Hydrochloric Acid SCHEMBL2701576 0.58 — —
SCHEMBL5354373 0.58 — —
SCHEMBL10395842 0.58 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 101 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024127112-A1 COMPOUNDS COMPRISING SULFUR AND (METH)ACRYLATE MOIETIES SUITABLE FOR BONDING ORGANIC POLYMERS TO METAL 3M INNOVATIVE PROPERTIES COMPANY (US) 2024-06-20 — — WO disclosed
US-20240141158-A1 Curable Epoxy Systems Comprising a Phenolic Polymer RAIN CARBON GERMANY GMBH (DE) 2024-05-02 — — US disclosed
WO-2023196026-A1 FORMULATION AND PROCESSING OF DEGRADABLE HIGH Tg EPOXY COMPOSITE THAT CAN BE DEGRADABLE AT EXTREMELY LOW TEMPERATURE CNPC USA CORPORATION (US) 2023-10-12 — — WO disclosed
US-20230323015-A1 Formulation and Processing of Degradable High Tg Epoxy Composite that can be degradable at Extremely Low Temperature CNPC USA CORPORATION 2023-10-12 — — US disclosed
EP-3926016-B1 ICEPHOBIC COATING AND COATED ARTICLES PALL CORP (US) 2023-05-24 — — EP disclosed
US-20230022703-A1 NOVEL BI-CONTINUOS EPOXY MICROSTRUCTURE FOR FABRICATION OF DEGRADABLE THERMOSET COMPOSITE USED IN HTHP DOWNHOLE CONDITIONS CNPC USA Corp. 2023-01-26 — — US disclosed
EP-4004110-A1 TEMPERATURE STABLE POLYMERIC BLENDS FOR USE IN NON-PNEUMATIC TIRES Bridgestone Americas Tire Operations, LLC (US) 2022-06-01 — — EP disclosed
US-20210395560-A1 ICEPHOBIC COATING AND COATED ARTICLES PALL CORPORATION 2021-12-23 — — US disclosed
EP-3926016-A1 ICEPHOBIC COATING AND COATED ARTICLES Pall Corporation (US) 2021-12-22 — — EP disclosed
WO-2021021273-A1 TEMPERATURE STABLE POLYMERIC BLENDS FOR USE IN NON-PNEUMATIC TIRES BRIDGESTONE AMERICAS TIRE OPERATIONS, LLC (US) 2021-02-04 — — WO disclosed
EP-1560708-A4 LABELING METHOD EMPLOYING TWO-PART CURABLE ADHESIVES AVERY DENNISON CORP (US) 2007-11-21 — — EP disclosed
EP-1560708-A1 LABELING METHOD EMPLOYING TWO-PART CURABLE ADHESIVES AVERY DENNISON CORPORATION (US) 2005-08-10 — — EP disclosed
US-20040058133-A1 Labeling method employing two-part curable adhesives AVERY DENNISON CORPORATION 2004-03-25 — — US disclosed
WO-2004009348-A1 LABELING METHOD EMPLOYING TWO-PART CURABLE ADHESIVES AVERY DENNISON CORPORATION (US) 2004-01-29 — — WO disclosed
EP-1109850-A1 PRIMERLESS SUBSTRATE REPAIR COMPOSITION AND METHOD Lord Corporation (US) 2001-06-27 — — EP disclosed
US-6153719-A PHOSPHORUS-CONTAINING COMPOUND HAVING AT LEAST ONE P--OH GROUP AND AT LEAST ONE ORGANIC MOIETY CHARACTERIZED BY THE PRESENCE OF AN ETHYLENICALLY UNSATURATED GROUP;PARTICULARLY USEFUL AS A SEALER FOR AN ADHESIVE JOINT. LORD CORPORATION (US) 2000-11-28 — — US disclosed
EP-1053271-A1 THIOL-CURED EPOXY COMPOSITION Lord Corporation (US) 2000-11-22 — — EP disclosed
WO-2000008086-A1 PRIMERLESS SUBSTRATE REPAIR COMPOSITION AND METHOD LORD CORPORATION (US) 2000-02-17 — — WO disclosed
US-5972423-A METHOD FOR REPAIRING SURFACE OF PLASTIC AUTOMOTIVE VEHICLE PART WITHOUT THE USE OF PRIMER COMPRISING APPLYING CURABLE FILLER COMPOSITION THAT INCLUDES AN EPOXY COMPOUND, POLYTHIOL CURING AGE, AND CATALYST; THEN CURING THE COMPOSITION LORD CORPORATION (US) 1999-10-26 — — US disclosed
WO-1999040142-A1 THIOL-CURED EPOXY COMPOSITION LORD CORPORATION (US) 1999-08-12 — — WO disclosed
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