⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Propane SCHEMBL28140822 | 0.93 | — | — | |
| SCHEMBL27966002 | 0.74 | — | — | |
| SCHEMBL10787607 | 0.72 | — | — | |
| SCHEMBL12898467 | 0.67 | — | — | |
| SCHEMBL3404310 | 0.65 | — | — | |
| SCHEMBL329798 | 0.64 | — | — | |
| SCHEMBL467781 | 0.61 | — | — | |
| SCHEMBL467604 | 0.61 | — | — | |
| SCHEMBL467723 | 0.61 | — | — | |
| SCHEMBL12006888 | 0.61 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 51 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240318001-A1 | Thick Film Low Refractive Index Polysiloxane Claddings | OPTITUNE OY (FI) | 2024-09-26 | — | — | US | claimed |
| EP-4370588-A1 | THICK FILM LOW REFRACTIVE INDEX POLYSILOXANE CLADDINGS | Optitune Oy (FI) | 2024-05-22 | — | — | EP | claimed |
| CN-117777454-A | UV resin, cross-linking agent, UV adhesive and preparation method thereof | 南方科技大学嘉兴研究院 | 2024-03-29 | — | — | CN | claimed |
| WO-2023285739-A1 | THICK FILM LOW REFRACTIVE INDEX POLYSILOXANE CLADDINGS | OPTITUNE OY (FI) | 2023-01-19 | — | — | WO | claimed |
| US-20240318001-A1 | Thick Film Low Refractive Index Polysiloxane Claddings | OPTITUNE OY (FI) | 2024-09-26 | — | — | US | disclosed |
| EP-4370588-A1 | THICK FILM LOW REFRACTIVE INDEX POLYSILOXANE CLADDINGS | Optitune Oy (FI) | 2024-05-22 | — | — | EP | disclosed |
| CN-117777454-A | UV resin, cross-linking agent, UV adhesive and preparation method thereof | 南方科技大学嘉兴研究院 | 2024-03-29 | — | — | CN | disclosed |
| CN-117777454-A | UV resin, cross-linking agent, UV adhesive and preparation method thereof | 南方科技大学嘉兴研究院 | 2024-03-29 | — | — | CN | disclosed |
| WO-2023285739-A1 | THICK FILM LOW REFRACTIVE INDEX POLYSILOXANE CLADDINGS | OPTITUNE OY (FI) | 2023-01-19 | — | — | WO | disclosed |
| CN-110461856-B | Method for producing alkoxyhydrosilane and method for producing alkoxyhalosilane | 株式会社钟化 | 2023-01-10 | — | — | CN | disclosed |
| CN-108139671-B | Photosensitive resin composition and cured film prepared therefrom | 罗门哈斯电子材料韩国有限公司 | 2022-02-11 | — | — | CN | disclosed |
| US-10890846-B2 | Photosensitive resin composition and cured film prepared therefrom | ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD (KR) | 2021-01-12 | — | — | US | disclosed |
| CN-102037000-A | Process for producing alpha-hetero-substituted alkylhalohydrosilanes and use thereof | KANEKA CORP | 2011-04-27 | — | — | CN | disclosed |
| EP-2308884-A1 | METHOD FOR PRODUCING -HETERO-SUBSTITUTED ALKYLHALOHYDROSILANE AND USE THEREOF | Kaneka Corporation (JP) | 2011-04-13 | — | — | EP | disclosed |
| US-6420269-B2 | USEFUL IN PRODUCING SEMICONDUCTOR CHIPS | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2002-07-16 | — | — | US | disclosed |
| CN-1069675-C | Silica-based isolation film, material for manufacturing same, and process for producing same | HITACHI CHEMICAL CO LTD (JP) | 2001-08-15 | — | — | CN | disclosed |
| US-6000339-A | Material for forming silica-base coated insulation film, process for producing the material, silica-base insulation film, semiconductor device, and process for producing the device | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1999-12-14 | — | — | US | disclosed |
| EP-0820092-A1 | CERIUM OXIDE ABRASIVE, SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, PROCESS FOR THE PRODUCTION OF THEM, AND METHOD FOR THE POLISHING OF SUBSTRATES | HITACHI CHEMICAL CO., LTD. (JP) | 1998-01-21 | — | — | EP | disclosed |
| CN-1151752-A | Material for forming silica-base coated insulation film, process for producing the material, silica-base insulation film, semiconductor device, and process for producing the device | HITACHI CHEMICAL CO LTD (JP) | 1997-06-11 | — | — | CN | disclosed |
| EP-0768352-A1 | MATERIAL FOR FORMING SILICA-BASE COATED INSULATION FILM, PROCESS FOR PRODUCING THE MATERIAL, SILICA-BASE INSULATION FILM, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING THE DEVICE | HITACHI CHEMICAL CO., LTD. (JP) | 1997-04-16 | — | — | EP | disclosed |