⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10588249 | 0.76 | — | — | |
| SCHEMBL23175009 | 0.70 | — | — | |
| SCHEMBL5460346 | 0.69 | — | — | |
| SCHEMBL861878 | 0.68 | — | — | |
| SCHEMBL14847296 | 0.67 | — | — | |
| SCHEMBL840999 | 0.67 | — | — | |
| SCHEMBL17064192 | 0.67 | — | — | |
| SCHEMBL8537265 | 0.62 | — | — | |
| SCHEMBL250650 | 0.60 | — | — | |
| SCHEMBL14265479 | 0.60 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 73 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20230406822-A1 | SILICON COMPOUND AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME | DNF CO., LTD. (KR) | 2023-12-21 | — | — | US | disclosed |
| CN-115298232-A | Modified conjugated diene polymer and rubber composition containing same | 株式会社LG化学 | 2022-11-04 | — | — | CN | disclosed |
| CN-110437272-B | Preparation method of ABA type organosilicon glucoheptonamide surfactant | 中国日用化学研究院有限公司 | 2022-10-11 | — | — | CN | disclosed |
| CN-109312111-B | High modulus curable composition | 汉高股份有限及两合公司 | 2021-05-25 | — | — | CN | disclosed |
| CN-108264883-B | Liquid optical silica gel composition, optical silica gel and double-glass photovoltaic module and preparation method thereof | 比亚迪股份有限公司 | 2020-06-19 | — | — | CN | disclosed |
| CN-110431213-A | Photochromic articles | SDC TECH INC | 2019-11-08 | — | — | CN | disclosed |
| CN-106062042-B | Silsesquioxane composite polymer and method for producing same | DONGJIN SEMICHEM CO.,LTD. (KR) | 2019-10-29 | — | — | CN | disclosed |
| CN-110382086-A | Carbon Molecular Sieve Membrane for subversive gas separation | 佐治亚科技研究公司 | 2019-10-25 | — | — | CN | disclosed |
| US-20190322809-A1 | LIQUID OPTICAL SILICONE COMPOSITION, OPTICAL SILICONE, DOUBLE-GLASS PHOTOVOLTAIC ASSEMBLY, AND PREPARATION METHOD THEREFOR | BYD COMPANY LIMITED (CN) | 2019-10-24 | — | — | US | disclosed |
| CN-105792917-B | Asymmetric modified carbon molecular sieve hollow fiber membranes with improved permeability | 佐治亚科技研究公司 | 2019-10-11 | — | — | CN | disclosed |
| US-6472334-B2 | FORMING SILICON-CONTAINING INSULATING FILM ON SUBSTRATE BY PLASMANIZING AND REACTING REACTION GAS THAT CONTAINS HYDROGEN, AN OXIDIZING GAS, AND A COMPOUND HAVING SILOXANE BOND AND SILICON-ALKYL BOND | CANON SALES CO., INC. (JP) | 2002-10-29 | — | — | US | disclosed |
| US-20010041458-A1 | Film forming method, semiconductor device manufacturing method, and semiconductor device | CANON SALES CO., INC. | 2001-11-15 | — | — | US | disclosed |
| EP-1143499-A2 | Film forming method for a semiconductor device | Canon Sales Co., Inc. (JP) | 2001-10-10 | — | — | EP | disclosed |
| CN-1257524-A | Process for hydrophobicizing particles, and their use as fillers in polymer masterbatches | BAYER INC (CA) | 2000-06-21 | — | — | CN | disclosed |
| EP-0552149-A4 | METHOD OF RENDERING MASONRY MATERIALS WATER REPELLENT WITH LOW VOC ORGANOALKOXYSILANES | — | 1993-12-08 | — | — | EP | disclosed |
| EP-0552149-A1 | METHOD OF RENDERING MASONRY MATERIALS WATER REPELLENT WITH LOW VOC ORGANOALKOXYSILANES | PROSOCO, INC. (US) | 1993-07-28 | — | — | EP | disclosed |
| WO-1992006101-A1 | METHOD OF RENDERING MASONRY MATERIALS WATER REPELLENT WITH LOW VOC ORGANOALKOXYSILANES | PROSOCO, INC. (US) | 1992-04-16 | — | — | WO | disclosed |
| US-4892918-A | TOUGHENING THERMOSETTING MATRIX RESINS | BASF CORPORATION (US) | 1990-01-09 | — | — | US | disclosed |
| US-4847154-A | Thermosetting resin systems containing secondary amine-terminated siloxane modifiers | BASF CORPORATION (US) | 1989-07-11 | — | — | US | disclosed |
| EP-0312771-A1 | Thermosetting resin systems containing secondary amine-terminated siloxane modifiers | BASF Aktiengesellschaft (DE) | 1989-04-26 | — | — | EP | disclosed |