SCHEMBL4757869

SCHEMBL4757869

CC(C)(C)OC(=O)C1CC=CCC1

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MIF P14174 1/20 0.42
HRH3 Q9Y5N1 1/20 0.39
ALDH1A1 P00352 2/20 0.38
MEN1 O00255 1/20 0.38
MAPT P10636 1/20 0.38
ALOX15 P16050 1/20 0.38
HTT P42858 1/20 0.38
KMT2A Q03164 1/20 0.38
ESR2 Q92731 1/20 0.38
HSD17B10 Q99714 1/20 0.38
TDP1 Q9NUW8 1/20 0.37
MAPK1 P28482 1/20 0.36
RAB9A P51151 1/20 0.34
LMNA P02545 1/20 0.33
TP53 P04637 1/20 0.33
TSHR P16473 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.33
CA1 P00915 1/20 0.32
CA2 P00918 1/20 0.32
CA7 P43166 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29202537 1.00 MIF (0.42) MIFHRH3ALDH1A1MEN1MAPT
SCHEMBL16086198 0.88 HRH3 (0.36) MIFHRH3ALDH1A1MEN1MAPT
SCHEMBL16086199 0.88 HRH3 (0.36) MIFHRH3ALDH1A1MEN1MAPT
SCHEMBL3893969 0.86 MAPK1 (0.41) HRH3MAPK1SMN1; SMN2HPGDBTK
SCHEMBL2533318 0.85 HRH3 (0.41) HRH3ALDH1A1MEN1MAPTHTT
Ammonia Solution, Strong SCHEMBL27979051 0.84 MAPK1 (0.40) HRH3MAPK1HPGDBTKCHRM2
SCHEMBL4017541 0.84 HRH3 (0.41) HRH3ALDH1A1MEN1MAPTHTT
SCHEMBL4017545 0.84 HRH3 (0.41) HRH3ALDH1A1MEN1MAPTHTT
SCHEMBL17616824 0.83 MIF (0.39) MIFALDH1A1MEN1MAPTALOX15
SCHEMBL19204886 0.82 MIF (0.36) MIFALDH1A1MEN1MAPTALOX15

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7851575-B2 Polycyclic polymers containing pendant ion conducting moieties PROMERUS LLC (US) 2010-12-14 US disclosed
US-7763412-B2 Polymer, positive resist composition and method for forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2010-07-27 US disclosed
US-7651831-B2 Positive photoresist composition with a polymer including a fluorosulfonamide group and process for its use INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2010-01-26 US disclosed
US-7638264-B2 forming pattern on semiconductors; acrylic terpolymer with fluorosulfonamide-containing unit e.g. 2-trifluoromethanesulfonylaminoethyl methacrylate, second unit having pendant acid labile group, and third unit having a lactone moiety, and acid generator; good etch resistance and dissolution properties INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2009-12-29 US disclosed
US-7604918-B2 Photosensitive polymer and photoresist composition having the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2009-10-20 US disclosed
US-7598016-B2 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-10-06 US disclosed
US-7514204-B2 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-04-07 US disclosed
US-20090011365-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-01-08 US disclosed
EP-1132774-B1 Polymer, resist composition and patterning process SHINETSU CHEMICAL CO (JP) 2009-01-07 EP disclosed
US-20080241736-A1 Immersion lithography; copolymer containing ammonium salt of carboxylic acid and fluorine monomer SHIN-ETSU CHEMICAL CO., LTD. (JP) 2008-10-02 US disclosed
US-20080233514-A1 POSITIVE PHOTORESIST COMPOSITION WITH A POLYMER INCLUDING A FLUOROSULFONAMIDE GROUP AND PROCESS FOR ITS USE INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2008-09-25 US disclosed
WO-2008106334-A2 FLAME RETARDED STYRENIC POLYMER FOAMS AND FOAM PRECURSORS ALBEMARLE CORPORATION (US) 2008-09-04 WO disclosed
US-20080096131-A1 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. 2008-04-24 US disclosed
US-20080063975-A1 Polymer, Positive Resist Composition and Method for Forming Resist Pattern TOKYO OHKA KOGYO CO., LTD (JP) 2008-03-13 US disclosed
CN-1129578-C Tetrahydrobenzindole derivatives MEIJI SEIKA KAISHA (JP) 2003-12-03 CN disclosed
CN-1286683-A Tetrahydrobenzindole derivatives MEIJI SEIKA KAISHA (JP) 2001-03-07 CN disclosed