Methacrylic Acid

Methacrylic Acid

SCHEMBL476057

C=C(C)C(=O)O.CC(O)CO.CC(O)CO.CC(O)CO

nearest known ligand 0.53

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

SLC5A2

The experimentally established mechanism targets of Methacrylic Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 3/20 0.53
TGFBR1 P36897 1/20 0.43
TSHR P16473 3/20 0.38
OR51E2 Q9H255 1/20 0.38
TP53 P04637 1/20 0.36
TET2 Q6N021 4/20 0.36
TET3 O43151 1/20 0.36
TET1 Q8NFU7 1/20 0.36
ALDH1A1 P00352 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Methacrylic Acid SCHEMBL2219402 1.00 TDP1 (0.53) TDP1TGFBR1TSHROR51E2TP53
Methacrylic Acid SCHEMBL5463979 1.00 TDP1 (0.53) TDP1TGFBR1TSHROR51E2TP53
Methacrylic Acid SCHEMBL2059780 1.00 TDP1 (0.53) TDP1TGFBR1TSHROR51E2TP53
Methacrylic Acid SCHEMBL18140227 1.00 TDP1 (0.53) TDP1TGFBR1TSHROR51E2TP53
Methacrylic Acid SCHEMBL475891 1.00 TDP1 (0.53) TDP1TGFBR1TSHROR51E2TP53
Methacrylic Acid SCHEMBL18140953 1.00 TDP1 (0.53) TDP1TGFBR1TSHROR51E2TP53
Methacrylic Acid SCHEMBL5462229 1.00 TDP1 (0.53) TDP1TGFBR1TSHROR51E2TP53
Methacrylic Acid SCHEMBL2059838 1.00 TDP1 (0.53) TDP1TGFBR1TSHROR51E2TP53
Methacrylic Acid SCHEMBL4653322 1.00 TDP1 (0.53) TDP1TGFBR1TSHROR51E2TP53
Methacrylic Acid SCHEMBL3067708 1.00 TDP1 (0.53) TDP1TGFBR1TSHROR51E2TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 205 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240218218-A1 OPTICALLY CLEAR UV AND THERMAL CURING EPOXY COMPOSITIONS HENKEL AG & CO KGAA (DE) 2024-07-04 US claimed
US-11732158-B2 Adhesive compositions HENKEL AG & CO. KGAA (DE) 2023-08-22 US claimed
WO-2023147115-A1 (METH)ACRYLATE-BASED TOUGHENED ADHESIVES HENKEL AG & CO. KGAA (DE) 2023-08-03 WO claimed
US-11667820-B2 Adhesive composition for polarizing plate, polarizing plate, and optical display device SAMSUNG SDI CO., LTD. (KR) 2023-06-06 US claimed
WO-2023043757-A1 OPTICALLY CLEAR UV AND THERMAL CURING EPOXY COMPOSITIONS Henkel IP & Holding GmbH (DE) 2023-03-23 WO claimed
EP-3612609-B1 ADHESIVE COMPOSITIONS HENKEL AG & CO KGAA (DE) 2022-12-28 EP claimed
US-20200071577-A1 ADHESIVE COMPOSITION FOR POLARIZING PLATE, POLARIZING PLATE, AND OPTICAL DISPLAY DEVICE Wuxi Hengxin Optoelectronic Materials Co., Ltd. (CN) 2020-03-05 US claimed
US-20200040223-A1 ADHESIVE COMPOSITIONS Henkel IP & Holding GmbH (DE) 2020-02-06 US claimed
US-20190136102-A1 ADHESIVE COMPOSITIONS CONTAINING REACTIVE SILSESQUIOXANES Henkel IP & Holding GmbH (DE) 2019-05-09 US claimed
EP-2924085-B1 COMPOSITION FOR ENCAPSULATION OF ORGANIC LIGHT EMITTING DIODE AND ORGANIC LIGHT EMITTING DIODE DISPLAY MANUFACTURED USING THE SAME SAMSUNG SDI CO LTD (KR) 2019-05-08 EP claimed
EP-2924085-A1 Composition for encapsulation of organic light emitting diode and organic light emitting diode display manufactured using the same Samsung SDI Co., Ltd. (KR) 2015-09-30 EP claimed
US-20150225626-A1 ADHESIVE COMPOSITIONS HENKEL AG & CO. KGAA (DE) 2015-08-13 US claimed
US-20140235758-A1 ADHESIVE COMPOSITIONS Henkel US IP LLC (US) 2014-08-21 US claimed
US-7935472-B2 Photo-curable resin composition and a method for forming a pattern using the same HITACHI CHEMICAL COMPANY, LTD. (JP) 2011-05-03 US claimed
US-20100065210-A1 FLOWABLE NON-SAGGING ADHESIVE COMPOSITIONS HENKEL CORPORATION (US) 2010-03-18 US claimed
WO-2008057414-A1 FLOWABLE, NON-SAGGING ADHESIVE COMPOSITIONS HENKEL CORPORATION (US) 2008-05-15 WO claimed
US-7115676-B2 Adhesive compositions for bonding passive substrates HENKEL CORPORATION (US) 2006-10-03 US claimed
US-20030217808-A1 Adhesive compositions for bonding passive substrates Henkel IP & Holding GmbH (DE) 2003-11-27 US claimed
EP-1285037-A2 ADHESIVE COMPOSITIONS FOR BONDING PASSIVE SUBSTRATES SUCH AS MAGNESIUM ALLOYS Henkel Loctite Corporation (US) 2003-02-26 EP claimed
WO-2001088050-A2 ADHESIVE COMPOSITIONS FOR BONDING PASSIVE SUBSTRATES SUCH AS MAGNESIUM ALLOYS HENKEL LOCTITE CORPORATION (US) 2001-11-22 WO claimed