Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31303937 | 0.96 | TSHR (0.32) | TSHR | |
| SCHEMBL29714879 | 0.92 | TSHR (0.33) | TSHRCA2 | |
| SCHEMBL29653547 | 0.92 | TSHR (0.33) | TSHRCA2 | |
| SCHEMBL30695096 | 0.92 | TSHR (0.33) | TSHRCA2 | |
| SCHEMBL191057 | 0.92 | TSHR (0.33) | TSHRCA2 | |
| SCHEMBL28667993 | 0.92 | TSHR (0.33) | TSHRCA2 | |
| SCHEMBL190154 | 0.92 | TSHR (0.33) | TSHRCA2 | |
| SCHEMBL191459 | 0.92 | TSHR (0.33) | TSHRCA2 | |
| SCHEMBL6739104 | 0.92 | — | — | |
| SCHEMBL28692840 | 0.92 | TSHR (0.33) | TSHRCA2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-112485968-B | Photosensitive resin composition, dry film, and printed wiring board having photocurable substance of photosensitive resin composition | 株式会社田村制作所 | 2025-03-11 | — | — | CN | disclosed |
| CN-114867807-B | Adhesive composition | 信越聚合物株式会社 | 2025-01-03 | — | — | CN | disclosed |
| CN-110297392-B | Photosensitive resin composition | 株式会社田村制作所 | 2024-08-30 | — | — | CN | disclosed |
| CN-114080439-B | Adhesive composition, adhesive sheet, laminate, and printed wiring board | 东洋纺MC株式会社 | 2024-01-26 | — | — | CN | disclosed |
| US-20230339216-A1 | TRANSPARENT RESIN FILM, PRODUCTION METHOD FOR TRANSPARENT RESIN FILM, DECORATIVE PANEL, AND PRODUCTION METHOD FOR DECORATIVE PANEL | DAI NIPPON PRINTING CO., LTD. (JP) | 2023-10-26 | — | — | US | disclosed |
| CN-115826353-A | Photosensitive resin composition, dry film comprising same, and printed wiring board comprising cured product of same | 株式会社田村制作所 | 2023-03-21 | — | — | CN | disclosed |
| EP-4134232-A1 | TRANSPARENT RESIN FILM, PRODUCTION METHOD FOR TRANSPARENT RESIN FILM, DECORATIVE PANEL, AND PRODUCTION METHOD FOR DECORATIVE PANEL | Dai Nippon Printing Co., Ltd. (JP) | 2023-02-15 | — | — | EP | disclosed |
| CN-107870514-B | Photosensitive resin composition | 株式会社田村制作所 | 2022-09-16 | — | — | CN | disclosed |
| CN-114901771-A | Adhesive composition | 信越聚合物株式会社 | 2022-08-12 | — | — | CN | disclosed |
| CN-114867807-A | Adhesive composition | 信越聚合物株式会社 | 2022-08-05 | — | — | CN | disclosed |
| CN-114846104-A | Adhesive composition | 信越聚合物株式会社 | 2022-08-02 | — | — | CN | disclosed |
| CN-111196066-B | Adhesive composition and adhesive layer-equipped laminate using same | 东亚合成株式会社 | 2022-05-10 | — | — | CN | disclosed |
| CN-114114843-A | Photosensitive dry film and method for manufacturing printed wiring board using photosensitive dry film | 株式会社田村制作所 | 2022-03-01 | — | — | CN | disclosed |
| US-7420007-B2 | Dialkylphosphinic salts | CLARIANT PRODUKTE (DEUTSCHLAND) GMBH (DE) | 2008-09-02 | — | — | US | disclosed |
| US-20060074157-A1 | Including the telomers: ethylbutylphospinic salts, butylbutylphosphinic salts, ethylhexylphosphinic salts, butylhexylphosphinic salts, or hexylhexylphosphinic salts; flame-retardant polymer molding materials | CLARIANT GMBH | 2006-04-06 | — | — | US | disclosed |