Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 2/20 | 0.44 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.44 |
| ▸ | THRB | P10828 | 2/20 | 0.41 |
| ▸ | TSHR | P16473 | 6/20 | 0.40 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.40 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.38 |
| ▸ | TP53 | P04637 | 2/20 | 0.38 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.38 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.38 |
| ▸ | HTT | P42858 | 1/20 | 0.36 |
| ▸ | MAPT | P10636 | 1/20 | 0.36 |
| ▸ | EPHX2 | P34913 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2367417 | 1.00 | MEN1 (0.44) | MEN1KMT2ATHRBTSHRMAPK1 | |
| SCHEMBL2807965 | 1.00 | MEN1 (0.44) | MEN1KMT2ATHRBTSHRMAPK1 | |
| SCHEMBL2809299 | 1.00 | MEN1 (0.44) | MEN1KMT2ATHRBTSHRMAPK1 | |
| SCHEMBL20994134 | 1.00 | MEN1 (0.44) | MEN1KMT2ATHRBTSHRMAPK1 | |
| SCHEMBL20994132 | 1.00 | MEN1 (0.44) | MEN1KMT2ATHRBTSHRMAPK1 | |
| SCHEMBL21081977 | 1.00 | MEN1 (0.44) | MEN1KMT2ATHRBTSHRMAPK1 | |
| SCHEMBL21081954 | 1.00 | MEN1 (0.44) | MEN1KMT2ATHRBTSHRMAPK1 | |
| SCHEMBL20994135 | 1.00 | MEN1 (0.44) | MEN1KMT2ATHRBTSHRMAPK1 | |
| SCHEMBL20994136 | 1.00 | MEN1 (0.44) | MEN1KMT2ATHRBTSHRMAPK1 | |
| SCHEMBL20994131 | 1.00 | MEN1 (0.44) | MEN1KMT2ATHRBTSHRMAPK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 245 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119798574-A | Gel electrolyte precursor, gel composite electrolyte, lithium ion battery and electric equipment | 比亚迪股份有限公司 | 2025-04-11 | — | — | CN | claimed |
| CN-117423898-A | Solid polymer electrolyte with local high-concentration structure, lithium battery and method | 南开大学 | 2024-01-19 | — | — | CN | claimed |
| CN-112912971-B | conductive paste | 藤仓化成株式会社 | 2023-09-26 | — | — | CN | claimed |
| CN-116179061-A | Fluorine-containing single-component polyurea coating and preparation method thereof | 浙江锦丰新材料科技有限公司 | 2023-05-30 | — | — | CN | claimed |
| CN-112103506-B | Quasi-solid battery anode slurry and preparation method and application thereof | 蜂巢能源科技有限公司 | 2022-03-22 | — | — | CN | claimed |
| CN-113224370-A | Gel electrolyte, preparation method and application thereof | 南开大学 | 2021-08-06 | — | — | CN | claimed |
| CN-112103506-A | Quasi-solid battery anode slurry and preparation method and application thereof | 蜂巢能源科技有限公司 | 2020-12-18 | — | — | CN | claimed |
| EP-2630948-B1 | EXTERNAL OIL-IN-WATER-TYPE SKIN PREPARATION | SHISEIDO CO LTD (JP) | 2018-08-22 | — | — | EP | claimed |
| CN-119798574-A | Gel electrolyte precursor, gel composite electrolyte, lithium ion battery and electric equipment | 比亚迪股份有限公司 | 2025-04-11 | — | — | CN | disclosed |
| US-20240230952-A1 | LAMINATE AND METHOD FOR MANUFACTURING LAMINATE | FUJIFILM CORPORATION (JP) | 2024-07-11 | — | — | US | disclosed |
| US-20240158553-A1 | FINE RESIN PARTICLE, COATING FILM-SOFTENING AGENT, MATTING AGENT FOR PAINTS, STRESS RELIEVER FOR CURABLE RESINS, LIGHT DIFFUSER, LIGHT DIFFUSING RESIN COMPOSITION, AND RESIN COMPOSITION | SEKISUI KASEI CO., LTD. (JP) | 2024-05-16 | — | — | US | disclosed |
| US-20240124702-A1 | FINE RESIN PARTICLE AND FINE RESIN PARTICLE-CONTAINING COMPOSITION | SEKISUI KASEI CO., LTD. (JP) | 2024-04-18 | — | — | US | disclosed |
| US-11958922-B2 | Vinyl-based resin particles and method for producing same | SEKISUI PLASTICS CO., LTD. (JP) | 2024-04-16 | — | — | US | disclosed |
| US-20240118609-A1 | RESIN COMPOSITION FOR SOLDER RESIST, SOLDER RESIST FILM, AND CIRCUIT BOARD | SEKISUI KASEI CO., LTD. (JP) | 2024-04-11 | — | — | US | disclosed |
| EP-0468077-A1 | Dental adhesive | MITSUBISHI RAYON CO., LTD. (JP) | 1992-01-29 | — | — | EP | disclosed |
| EP-0413174-A2 | Dental adhesive composition | MITSUBISHI RAYON CO., LTD. (JP) | 1991-02-20 | — | — | EP | disclosed |
| US-4968725-A | BONDING RESTORATIVE MATERIAL TO DENTIN WITHOUT PREETCHING | MITSUBISHI RAYON CO., LTD. (JP) | 1990-11-06 | — | — | US | disclosed |
| US-4885229-A | CONTAINING ACRYLATED ESTERS | 501 DAICEL CHEMICAL INDUSTRIES LTD. (JP) | 1989-12-05 | — | — | US | disclosed |
| EP-0321618-A1 | Photosensitive hardenable compositions | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 1989-06-28 | — | — | EP | disclosed |
| EP-0301516-A2 | Dental adhesive composition | MITSUBISHI RAYON CO., LTD. (JP) | 1989-02-01 | — | — | EP | disclosed |