Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 7/20 | 0.44 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.44 |
| ▸ | MEN1 | O00255 | 2/20 | 0.36 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.36 |
| ▸ | HTT | P42858 | 1/20 | 0.36 |
| ▸ | TSHR | P16473 | 1/20 | 0.36 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22042319 | 0.86 | KDM4E (0.41) | KDM4EALDH1A1MEN1KMT2AHTT | |
| SCHEMBL969367 | 0.86 | KDM4E (0.41) | KDM4EALDH1A1MEN1KMT2AHTT | |
| SCHEMBL4742262 | 0.86 | KDM4E (0.41) | KDM4EALDH1A1MEN1KMT2AHTT | |
| SCHEMBL3180360 | 0.85 | KDM4E (0.40) | KDM4EALDH1A1MEN1KMT2AHTT | |
| SCHEMBL1012047 | 0.82 | KDM4E (0.48) | KDM4EALDH1A1MEN1KMT2AHTT | |
| SCHEMBL1246446 | 0.81 | KDM4E (0.37) | KDM4EALDH1A1MEN1KMT2AHTT | |
| SCHEMBL21091724 | 0.81 | KDM4E (0.37) | KDM4EALDH1A1MEN1KMT2AHTT | |
| SCHEMBL8663017 | 0.79 | KDM4E (0.36) | KDM4EALDH1A1MEN1KMT2AHTT | |
| SCHEMBL6064003 | 0.79 | KDM4E (0.36) | KDM4EALDH1A1MEN1KMT2AHTT | |
| SCHEMBL6063189 | 0.79 | KDM4E (0.36) | KDM4EALDH1A1MEN1KMT2AHTT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20080199805-A1 | PHOTOSENSITIVE COMPOSITIONS EMPLOYING SILICON-CONTAINING ADDITIVES | FUJIFILM ELECTRONIC MATERIALS. U.S.A., INC. | 2008-08-21 | — | — | US | disclosed |
| WO-2008098189-A1 | PHOTOSENSITIVE COMPOSITIONS EMPLOYING SILICON-CONTAINING ADDITIVES | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-08-14 | — | — | WO | disclosed |