⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8437772 | 0.83 | — | — | |
| SCHEMBL331101 | 0.83 | — | — | |
| SCHEMBL9385117 | 0.80 | — | — | |
| SCHEMBL3481741 | 0.80 | — | — | |
| SCHEMBL9061448 | 0.78 | — | — | |
| SCHEMBL918156 | 0.78 | — | — | |
| SCHEMBL5010257 | 0.76 | — | — | |
| SCHEMBL3482021 | 0.75 | — | — | |
| SCHEMBL427581 | 0.73 | — | — | |
| SCHEMBL15760485 | 0.72 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119060507-B | Heat-resistant epoxy resin and preparation method thereof | 山东艾蒙特新材料有限公司 | 2025-04-01 | — | — | CN | claimed |
| CN-119060507-A | Heat-resistant epoxy resin and preparation method thereof | 山东艾蒙特新材料有限公司 | 2024-12-03 | — | — | CN | claimed |
| CN-119060507-B | Heat-resistant epoxy resin and preparation method thereof | 山东艾蒙特新材料有限公司 | 2025-04-01 | — | — | CN | disclosed |
| CN-119060507-A | Heat-resistant epoxy resin and preparation method thereof | 山东艾蒙特新材料有限公司 | 2024-12-03 | — | — | CN | disclosed |
| US-7335708-B2 | Addition cross-linking two-component silicone materials with a high Shore D hardness | KETTENBACH GMBH & CO. KG (DE) | 2008-02-26 | — | — | US | disclosed |
| US-20050159522-A1 | Additon cross-linking two-component silicon materials with a high shore d hardness | KETTENBACH GMBH & CO. KG (DE) | 2005-07-21 | — | — | US | disclosed |