SCHEMBL4801758

SCHEMBL4801758

CC(=O)O[Si](CCC1CCC2OC2C1)(C(C)C)C(C)C

nearest known ligand 0.30

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
PTGS1 P23219 1/20 0.30
PTGS2 P35354 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4812118 0.86 PTGS1 (0.30) PTGS1PTGS2
SCHEMBL6423477 0.83 PTGS1 (0.31) PTGS1PTGS2
SCHEMBL4807854 0.83 PTGS1 (0.34) PTGS1PTGS2
SCHEMBL3299307 0.83 PTGS1 (0.32) PTGS1PTGS2
SCHEMBL4802288 0.83 PTGS1 (0.32) PTGS1PTGS2
SCHEMBL4810412 0.81 PTGS1 (0.33) PTGS1PTGS2
SCHEMBL6423339 0.81
SCHEMBL6420603 0.80 PTGS1 (0.33) PTGS1PTGS2
SCHEMBL4806027 0.80 PTGS1 (0.31) PTGS1PTGS2
SCHEMBL4807433 0.80 PTGS1 (0.31) PTGS1PTGS2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117480273-A Primer composition for vapor deposition of inorganic oxide, cured product, and laminate DIC株式会社 2024-01-30 CN disclosed
WO-2023171514-A1 LAMINATE AND PACKAGING MATERIAL DIC株式会社 2023-09-14 WO disclosed
EP-3213915-B1 LAMINATE DAINIPPON INK & CHEMICALS (JP) 2019-08-14 EP disclosed
US-20170253965-A1 LAMINATE DIC CORPORATION (JP) 2017-09-07 US disclosed
EP-3213915-A1 LAMINATE DIC Corporation (JP) 2017-09-06 EP disclosed
US-20160137879-A1 INORGANIC FINE PARTICLE COMPOSITE BODY, METHOD FOR PRODUCING SAME, COMPOSITION AND CURED PRODUCT DIC CORPORATION (JP) 2016-05-19 US disclosed
EP-2990433-A1 INORGANIC FINE PARTICLE COMPOSITE BODY, METHOD FOR PRODUCING SAME, COMPOSITION AND CURED PRODUCT DIC Corporation (JP) 2016-03-02 EP disclosed
US-20140061970-A1 NANOIMPRINT CURABLE COMPOSITION, NANOIMPRINT-LITHOGRAPHIC MOLDED PRODUCT, AND METHOD FOR FORMING PATTERN DIC CORPORATION (JP) 2014-03-06 US disclosed
US-7435668-B2 Method for doping impurities, and for producing a semiconductor device and applied electronic apparatus using a solution containing impurity ions SONY CORPORATION (JP) 2008-10-14 US disclosed
US-7335539-B2 Method for making thin-film semiconductor device SONY CORPORATION (JP) 2008-02-26 US disclosed
US-20070298550-A1 Method for making thin-film semiconductor device SONY CORPORATION (JP) 2007-12-27 US disclosed
US-7273774-B2 Method for making thin-film semiconductor device SONY CORPORATION (JP) 2007-09-25 US disclosed
US-20060079033-A1 Method for making thin-film semiconductor device SONY CORPORATION (JP) 2006-04-13 US disclosed
US-6953754-B2 Functional device and method of manufacturing the same SONY CORPORATION (JP) 2005-10-11 US disclosed
US-20050181566-A1 Method for doping impurities, methods for producing semiconductor device and applied electronic apparatus SONY CORPORATION (JP) 2005-08-18 US disclosed
US-20040157470-A1 Functional device and production method therefor SONY CORPORATION (JP) 2004-08-12 US disclosed